Abstract: The invention relates to a method and a device for regulating the thickness of coatings or layers, in particular of bond coatings, wherein bonding is controlled in a programmed manner thereby taking into account the influence of disturbance variables. The invention can be used especially in the production of DVDs. The advantages of the present invention are reproducible accuracy in adjusting the thickness of the coating/bond coating and thus an increased production output.

Abstract: The invention relates to a method and a device for regulating the thickness of coatings or layers, in particular of bond coatings, wherein bonding is controlled in a programmed manner thereby taking into account the influence of disturbance variables. The invention can be used especially in the production of DVDs. The advantages of the present invention are reproducible accuracy in adjusting the thickness of the coating/bond coating and thus an increased production output.

Abstract: A method of preventing bubbles or small bubbles when connecting substrate parts of optical data carriers by means of an adhesive. At least one of the substrate parts and/or the adhesive is provided with electric charges.

Abstract: Apparatus for surface coating or for lacquering of a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate support 14 and can be driven or made to perform a rotating movement, wherein the medium to be applied or the lacquer fluid is applied to the substrate 2 via a feed device 6 which can be displaced in relation to the substrate 2 and/or can be driven. The substrate 2 or the substrate support 14 can be displaced by means of a guide device or in a connecting link guide 7 in such a way that in the area of the substrate 2 the feed device 6 for applying the fluid or the lacquer is conducted approximately parallel with the surface of the substrate 2 and can be stopped at any arbitrary point above the substrate 2 at an even height distance.

Abstract: An apparatus for surface coating or for lacquering a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate carrier 14 and can be driven or given a rotating movement by means of a drive device, wherein the material or the lacquer fluid 5 to be applied is placed on the substrate 2 from a feed device 6. The fluid medium or the lacquer 4 released by the substrate support 14 is delivered at least to a first collecting reservoir 17 which is connected with at least one filter 28, from where the fluid is indirectly or directly conducted via a pump 29 to the first collecting reservoir 27, wherein an underpressure can be set between a first flow-off line 33 of the first collecting reservoir 27 and the pump 29.