Abstract: A device for baking self-bond coil wires with one another and with a support on which a coil of the self-bond coil wires is supported. The coils are moved relative to a pressing means, such as a mold, and are heated prior to being pressed by the pressing mold. The heated wires are thus pressed and cooled at the same time thereby permitting rapid operation. The coils are convenient loaded sequentially onto a moveable conveyor member for movement to a pressing station. The coils are heated while being moved to the pressing station such as by passing electrical current through the wire of the coil. After pressing, each coil is removed from the conveyor member and a fresh coil is loaded on the conveyor for processing.