Abstract: A method of processing a transparent workpiece comprises directing a defect-forming laser beam to an impingement surface of a transparent workpiece, the defect-forming laser beam having a numerical aperture from 0.10 to 0.25, the transparent workpiece having a textured surface, the textured surface having an Ra value of greater than or equal to 0.5 ?m.

Abstract: The present invention relates to a method of laser processing a glass substrate, the method comprising: focusing a pulsed laser beam into a laser beam focal line into the glass substrate, the glass substrate having a feature formed on a first surface of the glass substrate, wherein a first portion of the laser beam focal line is focused at the first surface of the glass substrate and a second portion of the laser beam focal line is focused at a second surface of the glass substrate that is opposite the first surface, wherein a first set of rays exiting the optical arrangement at a first radius R1, as measured from a center of the optical arrangement forms the first portion of the laser beam focal line with a deflection angle of ?1, wherein a second set of rays exiting the optical arrangement at a second radius R2, as measured from the center of the optical arrangement forms the second portion of the laser beam focal line with a deflection angle of ?2, wherein R1 is less than R2; and wherein ?1 is greater than

Abstract: Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

Abstract: A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength ?, a spot size wo, and a Rayleigh range ZR that is greater than F D ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater.