Abstract: A method is provided for making a composite substrate for electronic semiconductor parts. The composite substrate has a metal core, an insulating layer, and a conducting layer. The insulating layer is deposited by chemical vapor deposition in the gaseous phase on the metal core, or by chemical vapor deposition in combination with other techniques, such as plasmaspraying and/or melting. The metal core is comprised of a highly heat-resistant refractory metal, e.g., molybdenum, tungsten, titanium, molybdenum-manganese alloy, or a high-alloy steel having a permeability of about 1.002. The insulating layer is comprised of an inorganic material such as aluminum oxide or aluminum nitride. The conducting layer typically comprises copper.

Abstract: A method for producing carbon coatings by sputtering comprises placing the target material to be sputtered which is made of a fibrous carbon material such as paper, velvet, wood, etc. which has been charred on the cathode. The apparatus comprises an electrode forming an anode which is arranged in spaced relationship to a cathode.