Patents by Inventor Reinhard Wittmann

Reinhard Wittmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6605487
    Abstract: A method for the manufacture of micro-mechanical components from a stack of layers having at least a substrate, a sacrificial layer and a layer which is to be undercut includes forming at least one etch hole in the layer, which is to be undercut, and providing at least one passivation layer for controlling a selective depositing of a cover material which closes each of the etch holes after a step of etching the sacrificial layer. The passivation layer makes it possible that the undercut layer elements do not become excessively thick or grow together with the substrate due to the deposition of the cover material.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: August 12, 2003
    Assignee: Infineon Technologies Aktiengesellschaft
    Inventors: Martin Franosch, Reinhard Wittmann, Catharina Pusch
  • Publication number: 20020086455
    Abstract: A method for the manufacture of micro-mechanical components from a stack of layers having at least a substrate, a sacrificial layer and a layer which is to be undercut includes forming at least one etch hole in the layer, which is to be undercut, and providing at least one passivation layer for controlling a selective depositing of a cover material which closes each of the etch holes after a step of etching the sacrificial layer. The passivation layer makes it possible that the undercut layer elements do not become excessively thick or grow together with the substrate due to the deposition of the cover material.
    Type: Application
    Filed: December 20, 2001
    Publication date: July 4, 2002
    Inventors: Martin Franosch, Reinhard Wittmann, Catharina Pusch