Abstract: A device for cooling components, comprising a housing in which a cavity is formed, in which a phase-change material is accommodated, the housing having at least one surface, which is able to be brought into contact with the component to be cooled, and at least one heat-dissipating surface. The cavity accommodating the phase-change material is enclosed by at least one coil, and the phase-change material includes ferromagnetic or magnetizable particles. Furthermore a method for cooling a component using the device is described.

Abstract: A device for cooling components, comprising a housing in which a cavity is formed, in which a phase-change material is accommodated, the housing having at least one surface, which is able to be brought into contact with the component to be cooled, and at least one heat-dissipating surface. The cavity accommodating the phase-change material is enclosed by at least one coil, and the phase-change material includes ferromagnetic or magnetizable particles. Furthermore a method for cooling a component using the device is described.

Abstract: A method and a device for correcting a signal of a sensor provide for maximally accurate drift compensation of a characteristics curve of the sensor. At least one characteristic quantity of the signal of the sensor is compared with a reference value. The signal of the sensor is corrected as a function of the comparison result. A value of the at least one characteristic quantity of the signal of the sensor derived from the signal of the sensor is formed as the reference value.

Abstract: A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite side of the support element. The connector pins are glass-mounted into pin blocks produced independently of the support element. The pin blocks are inserted into associated cutouts of the support element and fastened therein. The arrangement and number of the connector pins in the pin blocks can thereby be flexibly adapted to particular requirements with no need for modifications to the design of the support element. The material and the geometrical properties of the pin blocks can be optimally adapted to the glass-mounting process of the connector pins, while the material of the support element can be matched to the coefficient of thermal expansion of the attached circuit support.