Abstract: An electrical assembly which includes a first circuit member (e.g., TCM) with at least one conductive pin projecting therefrom for being frictionally and electrically engaged by a flexible portion of circuit means of a second circuit member (e.g., PCB). An opening is provided within the PCB relative to the flexible portions such that these portions project at least partly across the opening and frictionally engage respective conductive portions of the pin when inserted within the opening. Each of these flexible portions in turn is part of a circuit layer which may be coupled to respective conductive planes or the like within the PCB, while the respective conductive portions of the pin may in turn be electrically coupled to various conductive layers within/upon the TCM.

Abstract: A compliant portion of the tubular body of a compliant pin is configured with an elliptical cross section. Preferably, the tubular body is seamless but alternatively may have a seam with the edges of the seam connected together. The configuration is particularly useful for micro-miniature pins. In the preferred method embodiment, on one side of a member to which the pin is to be affixed, the leading end of a blank tubular pin is inserted into the mating receptacle of the member and such that the blank pin provides a protrusion or extension on the opposite side of the member. A compliant section with an elliptical cross section if formed in a predetermined part of the protrusion and thereafter the pin is partially retracted into the receptacle so that the compliant section coacts with the receptacle to affix the pin to the member.

Abstract: A circuit assembly (e.g., printed circuit board) including an insulative substrate having opposed surfaces each defining a walled opening therein. Each walled opening includes a layer of conductive material (e.g., copper) plated thereon, these openings being electrically connected through a common channel or the like, which channel in turn has been plated to include copper material therein. Located within each opening is a compliant contact pin including a compliant end portion designed to provide an interference fit within one of the respective openings and an extending portion designed for extending from the board's outer surfaces to be electrically connected to a designated external component (e.g., printed circuit board, wiring, conductive socket).

Abstract: Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.

Abstract: Nozzle for creating perturbations in a pressurized liquid filament issuing from an orifice in the nozzle in which the perturbations are caused by varying the cross-section of the orifice to produce corresponding variations in the cross-section of the liquid filament and induce subsequent breakup of the filament into a succession of drops.