Patents by Inventor Reinhold Ernst Nitsche

Reinhold Ernst Nitsche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6994542
    Abstract: A mold half carrier has first and second air flow compensating surface areas. The second air flow compensating surface area encloses the first air flow compensating surface area. The first air flow compensating surface area provides pressure compensation for formation of smaller containers. Both air flow compensating surface areas are utilized for formation of larger containers. A shut off valve controls air flow through a passage in the mold carrier extending between the first and second air flow compensating surface areas. The second air flow compensating surface area has an exhaust passage for bleeding unwanted pressurized air therefrom when the shut off valve is closed. The compensating surface areas are separated from each other by a common continuous groove and an O-ring mounted in the groove. The groove has an arcuate main portion for receiving the O-ring and an auxiliary portion into which a portion of the O-ring may collapse.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: February 7, 2006
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6948924
    Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: September 27, 2005
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6913455
    Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: July 5, 2005
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Publication number: 20040202746
    Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Applicant: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Publication number: 20040202745
    Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Applicant: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6099286
    Abstract: A universal mold carrier for use in a mold assembly compensates for parting forces associated with container formation by directing a compensating air flow pressure to the rear surface of the mold carrier. The mold carrier includes two mold halves adapted to matingly engage each other and hold within the mold carriers interchangeable mold shells. One of the mold carriers has an outside wall that has a plurality of independent air flow compensating surface areas located thereon. This mold carrier further has an air flow communication line interconnecting the independent air flow compensating surface areas. Shut off valves are located in the one carrier to close and to open the air flow communication line between adjacent independent air flow compensating surface areas to allow for adjustment of the compensating pressure.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: August 8, 2000
    Assignee: Wentworth Mould and Die Company
    Inventor: Reinhold Ernst Nitsche
  • Patent number: 5762981
    Abstract: A base assembly for use as a part of a mold assembly for making containers comprises an adaptor, a base insert (or base plug), and a wear ring. The base insert is made from aluminum and has a lower surface positioned on a flat upper supporting surface of the adaptor. The base insert has an upper surface with a ledge surrounding a recessed contoured pattern in the base insert Which pattern corresponds to a base of the container to be formed. The base insert has an annular side wall portion. The wear ring has an inner annular surface surrounding and engaging the annular side wall portion of the base insert to protect the annular side wall portion. The wear ring comprises a hardened wear resistant steel ring adapted to reinforce the base insert during formation of the container. The base insert and wear ring are secured to the adaptor by threaded fasteners that pass through threaded apertures in the adaptor, the base insert and the wear ring.
    Type: Grant
    Filed: September 10, 1996
    Date of Patent: June 9, 1998
    Assignee: Wentworth Mould and Die Company Limited
    Inventor: Reinhold Ernst Nitsche