Patents by Inventor Reinhold Gaertner

Reinhold Gaertner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Attachment member for semiconductor sensor device
    Patent number: 8093689
    Abstract: A semiconductor sensor device is electrically coupled to an object. An attachment member attaches the semiconductor sensor device to the object. The attachment member comprises a first conductive contact region and a second conductive contact region. An insulating portion is electrically isolates the semiconductor sensor device from the first conductive contact region and second conductive contact region.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: January 10, 2012
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Stadler, Harald Gossner, Reinhold Gaertner
  • Electrostatic discharge test system and electrostatic discharge test method
    Patent number: 7863920
    Abstract: A method of conducting an electrostatic discharge test on an integrated circuit is described. The method comprises configuring a test board assembly to emulate characteristics of a system in which the integrated circuit is to be used, coupling the integrated circuit to the test board assembly, and applying an electrostatic discharge test signal of system-level type to the test board assembly.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: January 4, 2011
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Gaertner, Wolfgang Stadler, Harald Gossner
  • Electrostatic Discharge Test System And Electrostatic Discharge Test Method
    Publication number: 20090066354
    Abstract: A method of conducting an electrostatic discharge test on an integrated circuit is described. The method comprises configuring a test board assembly to emulate characteristics of a system in which the integrated circuit is to be used, coupling the integrated circuit to the test board assembly, and applying an electrostatic discharge test signal of system-level type to the test board assembly.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 12, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Reinhold Gaertner, Wolfgang Stadler, Harald Gossner
  • Attachment Member for Semiconductor Sensor Device
    Publication number: 20090012439
    Abstract: A semiconductor sensor device is electrically coupled to an object. An attachment member attaches the semiconductor sensor device to the object. The attachment member comprises a first conductive contact region and a second conductive contact region. An insulating portion is electrically isolates the semiconductor sensor device from the first conductive contact region and second conductive contact region.
    Type: Application
    Filed: July 2, 2007
    Publication date: January 8, 2009
    Applicant: Infineon Technologies AG
    Inventors: Wolfgang STADLER, Harald Gossner, Reinhold Gaertner