Abstract: In manufacturing an electronic control unit, a stamped grid is assembled with electronic components and the components are electrically connected with parts of the stamped grid. Subsequently, a body is formed by injection molding plastic material around the components and assembling ends of the grid structure which remain free with fit-on components and electrically connect them. The fit-on components with the body are again surrounded by injection molding by plastic material, while leaving open an exterior frame structure of the stamped grid. Finally, the frame structure is assembled with additional components and/or stamped off.

Abstract: A method for producing semiconductor bodies having a glass covered defined dge profile from a semiconductor wafer comprising the steps of applying etch resistant protective coating to a surface oxide layer on the semiconductor wafer, cutting groove-shaped recesses in the wafer in a predetermined pattern, etching the wafer through the recesses to produce a deep portion passing through at least one pn-junction, removing the surface oxide layer and etch resistant coating, applying an insulating and stabilizing glass coating to the side faces of the deep portion of the wafer, applying a contact metal coating, dividing the wafer into semiconductor bodies along the center planes of selected deep portions of the wafer and covering the surface of the semiconductor bodies with an insulating lacquer at those portions which have been exposed by the dividing step.