Patents by Inventor Reinhold SCHWARZENBACHER
Reinhold SCHWARZENBACHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10483010Abstract: A system for reducing surface and embedded charge in a substrate includes a substrate support configured to support a substrate. A vacuum ultraviolet (VUV) assembly is arranged adjacent to the substrate and includes a housing and a VUV lamp that is connected to the housing and that generates and directs ultraviolet (UV) light at the substrate. A movement device is configured to move at least one of the VUV assembly and the substrate support during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate.Type: GrantFiled: September 7, 2016Date of Patent: November 19, 2019Assignee: LAM RESEARCH AGInventors: Rafal Dylewicz, Reinhold Schwarzenbacher, Xia Man, Kenichi Sano, David Lou, Milan Pliska
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Patent number: 10134611Abstract: A collector assembly for use with a spin chuck includes a base component, a top component and a first intermediate component configured to be fitted between the base component and the top component. The base, top and first intermediate components are configured so as to be interconnectable to form a process enclosure and so as to be separable from one another. The base component and the intermediate component each comprise collector wall segments such that when the base, top and first intermediate components are interfitted, the wall segments together define an outer side wall of the collector assembly.Type: GrantFiled: March 22, 2013Date of Patent: November 20, 2018Assignee: LAM RESEARCH AGInventors: Reinhold Schwarzenbacher, Ulrich Tschinderle
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Patent number: 9972514Abstract: An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.Type: GrantFiled: March 7, 2016Date of Patent: May 15, 2018Assignee: LAM RESEARCH AGInventors: Dietmar Hammer, Reinhold Schwarzenbacher, Milan Pliska, Bridget Hill, Michael Brugger
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Patent number: 9779979Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.Type: GrantFiled: February 24, 2014Date of Patent: October 3, 2017Assignee: LAM RESEARCH AGInventors: Reinhold Schwarzenbacher, Milan Pliska
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Publication number: 20170256433Abstract: An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.Type: ApplicationFiled: March 7, 2016Publication date: September 7, 2017Inventors: Dietmar HAMMER, Reinhold SCHWARZENBACHER, Milan PLISKA, Bridget HILL, Michael BRUGGER
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Patent number: 9698029Abstract: A method and device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis, and at least one dispenser for dispensing a fluid onto at least one surface of a wafer-shaped article. A collector surrounds the spin chuck for collecting process fluids, with at least two collector levels for separately collecting fluids in different collector levels. Each collector level comprises an exhaust gas collecting chamber leading to a respective exhaust gas conduit. At least one of the exhaust gas conduits comprises a valve mechanism that reciprocally restricts exhaust gas flow from its associated exhaust gas conduit while opening the exhaust gas conduit to an ambient environment outside the collector, and vice-versa.Type: GrantFiled: February 19, 2014Date of Patent: July 4, 2017Assignee: LAM RESEARCH AGInventors: Reinhold Schwarzenbacher, Christian Putzi
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Publication number: 20160376702Abstract: An apparatus for processing a wafer shaped article comprises a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation. A chamber surrounds and encloses the rotary chuck, the chamber comprising an upper opening. A lid is mounted externally of the chamber so as to be movable between a closed position in which the lid seals the upper opening, and an open position in which the lid uncovers the upper opening and is displaced laterally therefrom. The chamber is openable separately from the lid so as to permit a wafer shaped article to be introduced into the chamber in a direction perpendicular to the axis of rotation.Type: ApplicationFiled: June 26, 2015Publication date: December 29, 2016Inventors: Karl-Heinz HOHENWARTER, Michael PUGGL, Reinhold SCHWARZENBACHER, Milan PLISKA
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Patent number: 9484229Abstract: A device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis and at least one dispenser for dispensing liquid onto at least one surface of a wafer-shaped article. A liquid collector surrounds the spin chuck for collecting liquid spun off the substrate during rotation, with at least two collector levels for separately collecting liquids in different collector levels. At least one lifting device moves the spin chuck relative to the liquid collector. At least two exhaust levels are provided for separately collecting gas from an interior of the liquid collector. Each of the exhaust levels includes at least one opening communicating with an ambient exterior of the liquid collector and a door that closes and opens the opening. Each door on one of the exhaust levels can be opened and closed separately from each door on another exhaust level.Type: GrantFiled: November 14, 2011Date of Patent: November 1, 2016Assignee: LAM RESEARCH AGInventors: Otto Lach, Christian Aufegger, Reinhold Schwarzenbacher
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Publication number: 20150243543Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.Type: ApplicationFiled: February 24, 2014Publication date: August 27, 2015Applicant: LAM RESEARCH AGInventors: Reinhold SCHWARZENBACHER, Milan PLISKA
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Publication number: 20150235876Abstract: A method and device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis, and at least one dispenser for dispensing a fluid onto at least one surface of a wafer-shaped article. A collector surrounds the spin chuck for collecting process fluids, with at least two collector levels for separately collecting fluids in different collector levels. Each collector level comprises an exhaust gas collecting chamber leading to a respective exhaust gas conduit. At least one of the exhaust gas conduits comprises a valve mechanism that reciprocally restricts exhaust gas flow from its associated exhaust gas conduit while opening the exhaust gas conduit to an ambient environment outside the collector, and vice-versa.Type: ApplicationFiled: February 19, 2014Publication date: August 20, 2015Applicant: LAM RESEARCH AGInventors: Reinhold SCHWARZENBACHER, Christian PUTZI
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Patent number: 8899246Abstract: A device for processing wafer-shaped articles, comprises a chuck adapted to receive a wafer shaped article, and a collector surrounding the chuck. The collector comprises a base and a plurality of divider walls, as well as a plurality of nested partitions surrounding the chuck. Each of the plurality of nested partitions is positioned on a corresponding one of the plurality of divider walls, and each of the plurality of nested partitions is vertically movable so as to define a plurality of separate process regions within the collector depending on the vertical position of each of the plurality of nested partitions. At least one of the divider walls comprises an internal exhaust conduit communicating with an exhaust duct underlying the divider wall.Type: GrantFiled: November 23, 2011Date of Patent: December 2, 2014Assignee: Lam Research AGInventors: Ante Plazonic, Christian Aufegger, Reinhold Schwarzenbacher
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Publication number: 20140283935Abstract: A collector assembly for use with a spin chuck includes a base component, a top component and a first intermediate component configured to be fitted between the base component and the top component. The base, top and first intermediate components are configured so as to be interconnectable to form a process enclosure and so as to be separable from one another. The base component and the intermediate component each comprise collector wall segments such that when the base, top and first intermediate components are interfitted, the wall segments together define an outer side wall of the collector assembly.Type: ApplicationFiled: March 22, 2013Publication date: September 25, 2014Applicant: LAM RESEARCH AGInventors: Reinhold SCHWARZENBACHER, Ulrich TSCHINDERLE
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Publication number: 20140053982Abstract: An apparatus and method for processing wafer-shaped articles features a spin chuck that is axially displaceable between at least two exhaust levels within a surrounding collector. A gas supply system comprises ducts for supplying gas separately to a first interior region of the collector that is above the spin chuck and a second interior region that is below the spin chuck. The pressure differential within the collector above and below the spin chuck can thereby be controlled to prevent cross-contamination between collector levels.Type: ApplicationFiled: August 23, 2012Publication date: February 27, 2014Applicant: LAM RESEARCH AGInventors: Karl-Heinz HOHENWARTER, Reinhold SCHWARZENBACHER
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Publication number: 20130125379Abstract: A device for processing wafer-shaped articles, comprises a chuck adapted to receive a wafer shaped article, and a collector surrounding the chuck. The collector comprises a base and a plurality of divider walls, as well as a plurality of nested partitions surrounding the chuck. Each of the plurality of nested partitions is positioned on a corresponding one of the plurality of divider walls, and each of the plurality of nested partitions is vertically movable so as to define a plurality of separate process regions within the collector depending on the vertical position of each of the plurality of nested partitions. At least one of the divider walls comprises an internal exhaust conduit communicating with an exhaust duct underlying the divider wall.Type: ApplicationFiled: November 23, 2011Publication date: May 23, 2013Applicant: LAM RESEARCH AGInventors: Ante PLAZONIC, Christian AUFEGGER, Reinhold SCHWARZENBACHER
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Publication number: 20130118535Abstract: A device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis and at least one dispenser for dispensing liquid onto at least one surface of a wafer-shaped article. A liquid collector surrounds the spin chuck for collecting liquid spun off the substrate during rotation, with at least two collector levels for separately collecting liquids in different collector levels. At least one lifting device moves the spin chuck relative to the liquid collector. At least two exhaust levels are provided for separately collecting gas from an interior of the liquid collector. Each of the exhaust levels includes at least one opening communicating with an ambient exterior of the liquid collector and a door that closes and opens the opening. Each door on one of the exhaust levels can be opened and closed separately from each door on another exhaust level.Type: ApplicationFiled: November 14, 2011Publication date: May 16, 2013Applicant: LAM RESEARCH ABInventors: Otto LACH, Christian AUFEGGER, Reinhold SCHWARZENBACHER