Patents by Inventor Reiya KAWAMURA

Reiya KAWAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REDUCTION MATERIAL, COMPOSITE BODY AND REDUCTION METHOD
    Publication number: 20220144653
    Abstract: A reducing material including a two-dimensional hydrogen boride-containing sheet having a two-dimensional network composed of (BH)n (n?4). A composite including a two-dimensional hydrogen boride-containing sheet having a two-dimensional network composed of (BH)n (n?4) and a metal nanoparticle. A reduction method including: a step of dispersing the reducing material according to any one of Claims 1 to 5 in an organic solvent to prepare a dispersion liquid containing the reducing material; and a step of reducing a metal ion having a redox potential which is given as a standard electrode potential of ?0.26 V/SHE or higher by mixing the dispersion liquid with the metal ion.
    Type: Application
    Filed: March 3, 2020
    Publication date: May 12, 2022
    Inventors: Takahiro KONDO, Asahi FUJINO, Ryota ISHIBIKI, Taiga GOTO, Masahiro MIYAUCHI, Reiya KAWAMURA, Toru HIRABAYASHI, Shin-ichi ITO