Patents by Inventor Rekha Reddy

Rekha Reddy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Back-contact thin film semiconductor device structures and methods for their production
    Patent number: 11398575
    Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: July 26, 2022
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Rekha Reddy, Christopher Stender
  • Systems and methods for perforation and ohmic contact formation for GaN epitaxial lift-off using an etch stop layer
    Patent number: 10522363
    Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 31, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Robert McCarthy, Rekha Reddy
  • Systems and Methods for Perforation and Ohmic Contact Formation For GaN Epitaxial Lift-Off Using An Etch Stop Layer
    Publication number: 20190088495
    Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.
    Type: Application
    Filed: July 24, 2018
    Publication date: March 21, 2019
    Inventors: Christopher Youtsey, Robert McCarthy, Rekha Reddy
  • BACK-CONTACT THIN FILM SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR THEIR PRODUCTION
    Publication number: 20180294372
    Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
    Type: Application
    Filed: April 6, 2018
    Publication date: October 11, 2018
    Inventors: Christopher Youtsey, Rekha Reddy, Christopher Stender