Patents by Inventor Remco Henricus Wilhelmus Pijnenburg
Remco Henricus Wilhelmus Pijnenburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200348198Abstract: Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.Type: ApplicationFiled: November 16, 2018Publication date: November 5, 2020Inventors: Willem Frederik Adrianus Besling, Casper Van Der Avoort, Remco Henricus Wilhelmus Pijnenburg, Olaf Wunnicke, Jörg Siegert, Alessandro Faes
-
Publication number: 20200340875Abstract: A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.Type: ApplicationFiled: January 10, 2019Publication date: October 29, 2020Inventors: Willem Frederik Adrianus Besling, Remco Henricus Wilhelmus Pijnenburg, Kailash Vijayakumar, Jörg Siegert, Alessandro Faes
-
Publication number: 20190375628Abstract: The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).Type: ApplicationFiled: June 14, 2017Publication date: December 12, 2019Applicant: ams International AGInventors: Willem Frederik Adrianus BESLING, Casper van der AVOORT, Coenraad Cornelis TAK, Remco Henricus Wilhelmus PIJNENBURG, Olaf WUNNICKE, Hendrik BOUMAN
-
Patent number: 10444103Abstract: In an embodiment, a method for calibrating a pressure sensor device is disclosed. The method involves determining the resonant frequency of a membrane of the pressure sensor device after the pressure sensor device has been attached to a circuit board, calculating a change in the resonant frequency from a resonant frequency stored in memory, calculating strain of the membrane of the pressure sensor device from the change in resonant frequency, and calibrating the pressure sensor device based on a capacitance-to-pressure curve calculated using the strain of the membrane of the pressure sensor device.Type: GrantFiled: November 11, 2014Date of Patent: October 15, 2019Assignee: ams International AGInventors: Willem Frederik Adrianus Besling, Casper van der Avoort, Remco Henricus Wilhelmus Pijnenburg, Martijn Goossens
-
Publication number: 20190234821Abstract: A semiconductor device comprises a substrate body, an environmental sensor, a cap body and a volume of gas. The environmental sensor and the volume of gas are arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and at least one channel between the substrate body and the cap body connects the volume of gas with the environment of the semiconductor device such that the channel is permeable for gases.Type: ApplicationFiled: October 2, 2017Publication date: August 1, 2019Inventors: Willem Frederik Adrianus BESLING, Casper VAN DER AVOORT, Coenraad Cornelis TAK, Remco Henricus Wilhelmus PIJNENBURG, Olaf WUNNICKE, Martijn GOOSSENS
-
Patent number: 9726561Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.Type: GrantFiled: April 30, 2014Date of Patent: August 8, 2017Assignee: ams International AGInventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
-
Patent number: 9513184Abstract: One example discloses a MEMS device, including: a cavity having an internal environment; a seal isolating the internal environment from an external environment outside the MEMS device; wherein the seal is susceptible to damage in response to a calibration unsealing energy; wherein upon damage to the seal, a pathway forms which couples the internal environment to the external environment; and a calibration circuit capable of measuring the internal environment before and after damage to the seal.Type: GrantFiled: June 11, 2014Date of Patent: December 6, 2016Assignee: AMS INTERNATIONAL AGInventors: Martijn Goossens, Willem Frederik Adrianus Besling, Peter Gerard Steeneken, Casper van der Avoort, Remco Henricus Wilhelmus Pijnenburg
-
Patent number: 9340412Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.Type: GrantFiled: July 28, 2014Date of Patent: May 17, 2016Assignee: ams International AGInventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
-
Patent number: 9344805Abstract: A capacitive micro-electromechanical system (MEMS) microphone includes a semiconductor substrate having an opening that extends through the substrate. The microphone has a membrane that extends across the opening and a back-plate that extends across the opening. The membrane is configured to generate a signal in response to sound. The back-plate is separated from the membrane by an insulator and the back-plate exhibits a spring constant. The microphone further includes a back-chamber that encloses the opening to form a pressure chamber with the membrane, and a tuning structure configured to set a resonance frequency of the back-plate to a value that is substantially the same as a value of a resonance frequency of the membrane.Type: GrantFiled: November 24, 2009Date of Patent: May 17, 2016Assignee: NXP B.V.Inventors: Franz Felberer, Remco Henricus Wilhelmus Pijnenburg, Twan van Lippen, Iris Bominaar-Silkens
-
Publication number: 20160131550Abstract: In an embodiment, a method for calibrating a pressure sensor device is disclosed. The method involves determining the resonant frequency of a membrane of the pressure sensor device after the pressure sensor device has been attached to a circuit board, calculating a change in the resonant frequency from a resonant frequency stored in memory, calculating strain of the membrane of the pressure sensor device from the change in resonant frequency, and calibrating the pressure sensor device based on a capacitance-to-pressure curve calculated using the strain of the membrane of the pressure sensor device.Type: ApplicationFiled: November 11, 2014Publication date: May 12, 2016Applicant: ams International AGInventors: Willem Frederik Adrianus Besling, Casper van der Avoort, Remco Henricus Wilhelmus Pijnenburg, Martijn Goossens
-
Patent number: 9307319Abstract: A read out circuit for a sensor uses a feedback loop to bias the sensor to a desired operating point, such as the maximal possible sensitivity, but without the problem of an instable sensor position as known for the conventional read-out with constant charge. The reference bias to which the circuit is controlled is also varied using feedback control, but with a slower response than the main bias control feedback loop.Type: GrantFiled: April 10, 2013Date of Patent: April 5, 2016Assignee: NXP, B.V.Inventors: Klaus Reimann, Twan van Lippen, Remco Henricus Wilhelmus Pijnenburg, Iris Bominaar-Silkens, Robert Hendrikus Margaretha van Veldhoven
-
Publication number: 20160023893Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.Type: ApplicationFiled: July 28, 2014Publication date: January 28, 2016Applicant: ams International AGInventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
-
Publication number: 20150362395Abstract: One example discloses a MEMS device, including: a cavity having an internal environment; a seal isolating the internal environment from an external environment outside the MEMS device; wherein the seal is susceptible to damage in response to a calibration unsealing energy; wherein upon damage to the seal, a pathway forms which couples the internal environment to the external environment; and a calibration circuit capable of measuring the internal environment before and after damage to the seal.Type: ApplicationFiled: June 11, 2014Publication date: December 17, 2015Inventors: Martijn Goossens, Willem Frederik Adrianus Besling, Peter Gerard Steeneken, Casper van der Avoort, Remco Henricus Wilhelmus Pijnenburg
-
Patent number: 8913766Abstract: A MEMS device, such as a microphone, uses a fixed perforated plate. The fixed plate comprises an array of holes across the plate area. At least a set of the holes adjacent the outer periphery comprises a plurality of rows of elongate holes, the rows at different distances from the periphery. This design improves the mechanical robustness of the membrane and can additionally allow tuning of the mechanical behavior of the plate.Type: GrantFiled: August 29, 2012Date of Patent: December 16, 2014Assignee: NXP, B.V.Inventors: Iris Bominaar-Silkens, Andres Felipe Vasquez Quintero, Klaus Reimann, Twan Van Lippen, Remco Henricus Wilhelmus Pijnenburg
-
Patent number: 8906534Abstract: A device is provided that includes a battery layer on a substrate, where a first battery cell is formed in the battery layer. The first battery cell includes a first anode, a first cathode, and a first electrolyte arranged between the first anode and the first cathode, where the first anode, the first cathode, and the first electrolyte are arranged in the battery layer such that perpendicular projections onto the substrate of each of the first anode and the first cathode are non-overlapping. A method of manufacturing such device is also provided. A system is also provide that includes such device for supplying power to an electronic device.Type: GrantFiled: May 28, 2009Date of Patent: December 9, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Romano Hoofman, Aurelie Humbert, Matthias Merz, Youri Victorovitch Ponomarev, Remco Henricus Wilhelmus Pijnenburg, Gilberto Curatola
-
Patent number: 8901682Abstract: A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each cell comprises a line of material following a path around the polygon thereby defining an opening in the center. In one aspect, the line of material forms a path along each side of the polygon which forms a track which extends at least once inwardly from the polygon perimeter towards the center of the polygon and back outwardly to the polygon perimeter. This defines a meandering hexagon side wall, which functions as a local spring suspension.Type: GrantFiled: April 12, 2013Date of Patent: December 2, 2014Assignee: NXP, B.V.Inventors: Klaus Reimann, Iris Bominaar-Silkens, Twan Van Lippen, Remco Henricus Wilhelmus Pijnenburg
-
Publication number: 20140338459Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.Type: ApplicationFiled: April 30, 2014Publication date: November 20, 2014Applicant: NXP B.V.Inventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
-
Patent number: 8822254Abstract: A MEMS manufacturing method and device in which a spacer layer is provided over a side wall of at least one opening in a structural layer which will define the movable MEMS element. The opening extends below the structural layer. The spacer layer forms a side wall portion over the side wall of the at least one opening and also extends below the level of the structural layer to form a contact area.Type: GrantFiled: December 6, 2011Date of Patent: September 2, 2014Assignee: NXP, B.V.Inventors: Jozef Thomas Martinus Van Beek, Klaus Reimann, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen
-
Patent number: 8715592Abstract: An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.Type: GrantFiled: January 31, 2013Date of Patent: May 6, 2014Assignee: Koninklijke Philips N.V.Inventors: Ronald Dekker, Remco Henricus Wilhelmus Pijnenburg, Nicolaas Johannes Anthonius Van Veen
-
Patent number: 8588435Abstract: A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.Type: GrantFiled: October 21, 2010Date of Patent: November 19, 2013Assignee: NXP B.V.Inventors: Iris Bominaar-Silkens, Sima Tarashioon, Remco Henricus Wilhelmus Pijnenburg, Twan van Lippen, Geert Langereis