Patents by Inventor Remco van Weeren

Remco van Weeren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5997795
    Abstract: Solid freeform fabrication techniques are used in direct methods to form photonic bandgap structures, and in indirect methods to form molds for photonic bandgap structures. In the direct methods, solid particulate materials are mixed with a binder and, through a computer-controlled process, are built layer by layer to form the structure. In the indirect methods, unfilled polymeric materials are built layer by layer to form a negative mold for the photonic bandgap structure. The cavities within the mold may then be filled with a slurry incorporating solid particulate materials. Subsequent processing may include mold removal, binder removal, densification and secondary infiltration steps to form a photonic bandgap structure having the desired properties.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: December 7, 1999
    Assignee: Rutgers, The State University
    Inventors: Stephen C. Danforth, Ahmad Safari, John Ballato, Remco Van Weeren, Amit Bandyopadhyay
  • Patent number: 5932507
    Abstract: A ceramic body having a surface region containing tetragonal zirconia is sintered to at least 95% theoretical density at a temperature below about 1550 .degree. C. The surface region is then heat treated to reverse local stresses therein. Low temperature degradation in tetragonal zirconia, and materials containing tetragonal zirconia, is significantly inhibited. The heat treated ceramic is especially suited for use in structural components such as valves, engine housings, pistons (chambers) and the like which, during operation, are frequently exposed to temperatures ranging from room temperature to 500.degree. C. for prolonged periods of time.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: August 3, 1999
    Inventors: Remco van Weeren, Jeffrey A. Goldacker, Philip J. Whalen
  • Patent number: 5900207
    Abstract: A fused deposition process is used to form three-dimensional solid objects from a mixture including a particulate composition dispersed in a binder. The article is formed by depositing the mixture in repeated layers of predefined thickness, with each layer solidifying before the next adjacent layer is dispensed. Following formation and a binder removal step, the article may be at least partially densified to achieve preselected properties. The process permits three-dimensional articles to be formed relatively quickly and inexpensively, without the need for molds or other tooling.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: May 4, 1999
    Assignees: Rutgers, the State University Old Queens, Stratasys, Inc.
    Inventors: Stephen C. Danforth, Mukesh Agarwala, Amit Bandyopadghyay, Noshir Langrana, Vikram R. Jamalabad, Ahmad Safari, Remco van Weeren, William R. Priedeman, Jr.
  • Patent number: 5738817
    Abstract: A fused deposition process is used to form three-dimensional solid objects from a mixture including a particulate composition dispersed in a binder. The article is formed by depositing the mixture in repeated layers of predefined thickness, with each layer solidifying before the next adjacent layer is dispensed. Following formation and a binder removal step, the article may be at least partially densified to achieve preselected properties. The process permits three-dimensional articles to be formed relatively quickly and inexpensively, without the need for molds or other tooling.
    Type: Grant
    Filed: February 8, 1996
    Date of Patent: April 14, 1998
    Assignee: Rutgers, The State University
    Inventors: Stephen C. Danforth, Mukesh Agarwala, Amit Bandyopadghyay, Noshir Langrana, Vikram R. Jamalabad, Ahmad Safari, Remco van Weeren