Patents by Inventor Remi A. Trottier
Remi A. Trottier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11898015Abstract: A process to form coated polymer particles comprising polymer particles formed from a polymer composition comprising an olefin-based polymer, and a coating formed from a coating composition comprising an aqueous metal acid dispersion and an aqueous polysiloxane emulsion, said process comprising the following: mixing together the aqueous metal acid dispersion and the aqueous polysiloxane emulsion to form a dispersion/emulsion mixture; applying the dispersion/emulsion mixture to a portion of the surfaces of the polymer particles to form wet-coated polymer particles; drying the wet-coated polymer particles to form the coated polymer particles. The aqueous metal acid dispersion and the aqueous polysiloxane emulsion may also be applied, individually, in separate steps.Type: GrantFiled: June 28, 2019Date of Patent: February 13, 2024Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, George W. Haun, Jr., Harold W. Boone, Intan M. Hamdan, Michael D. Turner
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Patent number: 11873400Abstract: A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, wherein x=7; C) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.Type: GrantFiled: June 25, 2019Date of Patent: January 16, 2024Assignees: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Nicholas B. Schaffer, Kevin J. Bouck, Sarah E. Decato, Shrikant Dhodapkar, Intan M. Hamdan, Remi A. Trottier, Richard A. Lundgard
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Patent number: 11421085Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film. The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.Type: GrantFiled: May 8, 2019Date of Patent: August 23, 2022Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, Santosh S. Bawiskar, Kyle D. Anderson
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Patent number: 11355261Abstract: A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.Type: GrantFiled: December 14, 2017Date of Patent: June 7, 2022Assignee: DOW GLOBAL TECHNOLOGIES LLCInventors: Yichi Zhang, Timothy J. Person, Shrikant Dhodapkar, Remi A. Trottier
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Publication number: 20210155798Abstract: A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, wherein x=7; C) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.Type: ApplicationFiled: June 25, 2019Publication date: May 27, 2021Inventors: Nicholas B. Schaffer, Kevin J. Bouck, Sarah E. Decato, Shrikant Dhodapkar, Intan M. Hamdan, Remi A. Trottier, Richard A. Lundgard
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Patent number: 10683398Abstract: A composition is provided that comprises at least the following: polymer particles comprising a coating on at least a portion of the total surface of the polymer particles, and wherein the coating is formed from a powder composition comprising at least one inorganic powder, and at least one organic powder selected from a metal stearate and/or a polymer powder, and wherein the weight ratio of the total amount of the inorganic powder to the total amount of the organic powder is from 3.0 to 50.0.Type: GrantFiled: September 16, 2016Date of Patent: June 16, 2020Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, Robert Bellair, Konanur Manjunath, Pradeep Jain, Michael D. Turner
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Publication number: 20190348193Abstract: A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.Type: ApplicationFiled: December 14, 2017Publication date: November 14, 2019Inventors: Yichi Zhang, Timothy J. Person, Shrikant Dhodapkar, Remi A. Trottier
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Publication number: 20190263581Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film. The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.Type: ApplicationFiled: May 8, 2019Publication date: August 29, 2019Inventors: Shrikant Dhodapkar, Remi A. Trottier, Santosh S. Bawiskar, Kyle D. Anderson
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Patent number: 10329071Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film. The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.Type: GrantFiled: March 14, 2014Date of Patent: June 25, 2019Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, Santosh S. Bawiskar, Kyle D. Anderson
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Publication number: 20180265650Abstract: A composition is provided that comprises at least the following: polymer particles comprising a coating on at least a portion of the total surface of the polymer particles, and wherein the coating is formed from a powder composition comprising at least one inorganic powder, and at least one organic powder selected from a metal stearate and/or a polymer powder, and wherein the weight ratio of the total amount of the inorganic powder to the total amount of the organic powder is from 3.0 to 50.0.Type: ApplicationFiled: September 16, 2016Publication date: September 20, 2018Inventors: Shrikant Dhodapkar, Remi A. Trottier, Robert Bellair, Konanur Manjunath, Pradeep Jain, Michael D. Turner
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Publication number: 20160039593Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.Type: ApplicationFiled: March 14, 2014Publication date: February 11, 2016Inventors: Shrikant Dhodapkar, Remi Trottier, Santosh S. Bawiskar, Kyle D. Anderson
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Patent number: 9134213Abstract: Test method for structures, e.g., such as carriers and/or catalysts. The methods may be used to select the carriers and/or catalysts for future use. Carriers and catalysts so selected, and processes making use of these, are also provided.Type: GrantFiled: May 10, 2012Date of Patent: September 15, 2015Assignee: Dow Technology Investments LLCInventors: John R. Mayer, Sasanka Raha, Balu S. Uphade, Lester K. Cantu, Remi A. Trottier, Hwaili Soo
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Publication number: 20140090447Abstract: Test method for structures, e.g., such as carriers and/or catalysts. The methods may be used to select the carriers and/or catalysts for future use. Carriers and catalysts so selected, and processes making use of these, are also provided.Type: ApplicationFiled: May 10, 2012Publication date: April 3, 2014Applicant: DOW TECHNOLOGY INVESTMENTS, LLCInventors: John R. Mayer, Sasanka Raha, Balu S. Uphade, Lester K. Cantu, Remi A. Trottier, Hwaili Soo