Patents by Inventor Remi Bergmann

Remi Bergmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230306918
    Abstract: The device for displaying information, in particular for a vehicle, is provided with a display unit having a plurality of pixels and having a front side forming the display surface for displaying information and a rear side facing away from the front side. Furthermore, the device comprises a backlighting unit for emitting backlight towards the rear side of the display unit for backlighting the same, and an adjustable transreflective layer between the backlighting unit and the display unit. The adjustable transreflective layer has an array of segments, each of which is controllable by means of an electric control signal to adjust the degree of transmission and/or reflection and is thus dimmable. The contrast of information shown on the display surface can be adjusted by dimming, as a result of controlling the segments, those pixels of the display unit which are arranged in alignment with the segment or segments concerned and are assigned to the same.
    Type: Application
    Filed: August 5, 2021
    Publication date: September 28, 2023
    Inventors: Tuomas SIEKKINEN, Remi BERGMANN
  • Patent number: 9618973
    Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 11, 2017
    Assignee: Intel Corporation
    Inventors: Remi Bergmann, Erkki Nokkonen, Juha Paavola, Hannu Luoma, Kari Vallius
  • Publication number: 20160378140
    Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Applicant: Intel Corporation
    Inventors: Remi Bergmann, Erkki Nokkonen, Juha Paavola, Hannu Luoma, Kari Vallius