Abstract: A heat exchange structure, and an assembly as well as to a heat exchange device comprising such a structure, applying heat transfer by boiling of a liquid and comprising a substrate and at least one layer intended to be in contact with a liquid and at least partly positioned on the substrate. The composition of this layer comprises at least a molecular switch having a lower critical solubility temperature TLCST above which it gives the layer non-wetting properties towards the liquid and below which it gives the layer wetting properties towards the liquid, this lower critical solubility temperature TLCST of the molecular switch being selected so as to be greater than or equal to the saturation temperature Tsat of the liquid.