Abstract: The present invention relates to a film comprising at least one layer comprising an ethylene homo- or copolymer which has a complex viscosity at 5 kPa shear stress eta5 of 200,000 or less and a shear thinning index SHI(5/300) measured at 190° C. as the ratio between the complex viscosity at 5 kPa shear stress and the complex viscosity at 300 kPa shear stress of 120 or more.

Abstract: The present invention relates to a polyethylene composition, comprising a base resin which comprises (i) a first fraction which is an ethylene homo- or copolymer, and (ii) a second fraction which is an ethylene copolymer, wherein the first fraction (i) has a lower weight average molecular weight than the second fraction (ii), and the base resin has a density of less than 0.940 g/cm3 and a shear thinning index SHI2.7/210 of at least 25.

Abstract: The present invention relates to a polyethylene composition, comprising a base resin which comprises (i) a first fraction which is an ethylene homo- or copolymer, and (ii) a second fraction which is an ethylene copolymer, wherein the first fraction (i) has a lower weight average molecular weight than the second fraction (ii), and the base resin has a density of less than 0.940 g/cm3 and a shear thinning index SHI2.7/210 of at least 25.

Abstract: The present invention concerns a multimodal polyethylene composition comprising a base resin comprising three ethylene homo- or copolymer fractions (A), (B) and (C) with different weight average molecular weight Mw, wherein a) fraction (A) has an MFR21 equal or lower than 20 g/10 min, b) fraction (B) has a lower weight average molecular weight than fraction (C), c) fraction (C) has a lower weight average molecular weight than fraction (A), d) the composition has a viscosity at a shear stress of 747 Pa (eta747) of 350 kPas or higher, and e) the composition has a MFR5 of 0.15 g/10 min or higher and a white spot area of 1% or below. Furthermore, the present invention relates to a process for the production of such a composition as well as to the use of such a composition for the production of a pipe, for moulding applications, and wire and cable applications.

Abstract: The present invention relates to a polyethylene resin comprising A) a first ethylene homo- or copolymer fraction, and B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), characterized in that the polymer resin powder obtained directly after the final polymerisation step has a particle size distribution PSD95/5 equal to or smaller than 12. Furthermore, the invention relates to a process for the production of a polymer composition comprising: (i) a step in which ethylene monomers, and optionally further alpha-olefin-comonomers, are polymerised in liquid phase in the presence of a polymerisation catalyst, (ii) a step in which ethylene monomers, and optionally further alpha-olefin comonomers, are polymerised in the gas phase in the presence of a polymerisation catalyst, and (iii) obtaining a polymer resin powder after the final polymerisation step wherein the powder has a particle size distribution PSD95/5 equal to or smaller than 12.

Abstract: A power or communications cable having an outer sheath layer made of a polyethylene composition including a base resin which comprises (A) a first ethylene homo- or copolymer fraction, and (B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), and the base resin has a molecular weight distribution Mw/Mn of more than 14.

Abstract: The present invention in a first embodiment concerns a multimodal, preferably bimodal, polyethylene composition comprising a base resin which comprises (A) a first ethylene homo- or copolymer fraction, and (B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), the ratio of the MFR2 of fraction (A) and the MFR5 of the base resin being from 200 to 1500, and the composition has a white spot area of 1% or below. In a second embodiment, the present invention concerns a polyethylene composition comprising a base resin comprising (A) a first ethylene homo- or copolymer fraction, and (B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), the ratio of the MFR2 of fraction (A) and the MFR5 of the base resin being from 200 to 1500, and the composition has a rating in the ISO 18553 white spot rating test of below 4.5.

Abstract: The present invention relates to a film comprising at least one layer comprising an ethylene homo- or copolymer which has a complex viscosity at 5 kPa shear stress eta5 of 200,000 or less and a shear thinning index SHI(5/300) measured at 1900 C as the ratio between the complex viscosity at 5 kPa shear stress and the complex viscosity at 300 kPa shear stress of 120 or more.

Abstract: The present invention relates to a polyethylene resin comprising A) a first ethylene homo- or copolymer fraction, and B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), characterized in that the polymer resin powder obtained directly after the final polymerisation step has a particle size distribution PSD95/5 equal to or smaller than 12. Furthermore, the invention relates to a process for the production of a polymer composition comprising: (i) a step in which ethylene monomers, and optionally further alpha-olefin-comonomers, are polymerised in liquid phase in the presence of a polymerisation catalyst, (ii) a step in which ethylene monomers, and optionally further alpha-olefin comonomers, are polymerised in the gas phase in the presence of a polymerisation catalyst, and (iii) obtaining a polymer resin powder after the final polymerisation step wherein the powder has a particle size distribution PSD95/5 equal to or smaller than 12.

Abstract: The present invention relates to a power or communications cable comprising an outer sheath layer made of a polyethylene composition comprising a base resin which comprises (A) a first ethylene homo- or copolymer fraction, and (B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular weight than fraction (B), and the base resin has a molecular weight distribution Mw/Mn of more than 14.