Abstract: Device (1) for moving a connector (3) of an electric vehicle charger, comprising: an actuated mechanism, for moving an actuator attachment point (2) for the suspension of the connector (3), a connector attachment point (27), for the connector (3), the connector (3) provided with one end (4) adapted for electrical and mechanical connection with a socket of an electric vehicle, by movement in a plug-in direction (D); a suspension, coupled to the actuator attachment point (2), and carrying the connector attachment point (27), wherein the suspension carries the connector attachment point (27) in a preferred orientation, from which the connector (3) is movable, in particular compliantly movable relative to the actuator attachment point (2) under application of a force exerted on the connector attachment point (27), wherein the connector attachment point (27) is at least rotatable about an axis of rotation at an angle not parallel and preferably perpendicular to the plug-in direction wherein the axis of rotation in

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.