Patents by Inventor Remya Chandran
Remya Chandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240282742Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.Type: ApplicationFiled: February 21, 2024Publication date: August 22, 2024Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Shamik Ghosal, Remya Chandran, Venodh Manoharan, Siuli Sarkar, Bawa Singh, Rahul Raut
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Patent number: 11929341Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.Type: GrantFiled: June 21, 2019Date of Patent: March 12, 2024Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Remya Chandran, Venodh Manoharan, Siuli Sarkar, Bawa Singh, Rahul Raut
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Publication number: 20220371089Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.Type: ApplicationFiled: September 24, 2020Publication date: November 24, 2022Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
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Patent number: 11389865Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: June 12, 2015Date of Patent: July 19, 2022Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
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Publication number: 20220169905Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 4, 2021Publication date: June 2, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11162007Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: March 1, 2019Date of Patent: November 2, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20210205935Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: ApplicationFiled: January 14, 2021Publication date: July 8, 2021Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Publication number: 20210162496Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.Type: ApplicationFiled: June 21, 2019Publication date: June 3, 2021Inventors: Shamik GHOSAL, Remya CHANDRAN, Venodh MANOHARAN, Siuli SARKAR, Bawa SINGH, Rahul RAUT
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Patent number: 10894302Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: GrantFiled: June 22, 2015Date of Patent: January 19, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Publication number: 20190194517Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10259980Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: October 29, 2013Date of Patent: April 16, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20170144221Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: ApplicationFiled: June 12, 2015Publication date: May 25, 2017Inventors: Shamik GHOSHAL, V. Sathish KUMAR, Pavan VISHWANATH, Ranjit S. PANDHER, Remya CHANDRAN, Sutapa MUKHERJEE, Siuli SARKAR, Bawa SINGH, Ravindra Mohan BHATKAL
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Publication number: 20170113306Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: ApplicationFiled: June 22, 2015Publication date: April 27, 2017Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Publication number: 20150353804Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 29, 2013Publication date: December 10, 2015Applicant: ALPHA METALS, INC.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
