Abstract: An integrated device comprising a die substrate; a die interconnection portion coupled to the die substrate; and a metallization interconnect coupled to the die interconnection portion. The metallization interconnect comprises an adhesion metal layer, a first metal layer coupled to the adhesion metal layer; a second metal layer coupled to the first metal layer, and a third metal layer coupled to the second metal layer.

Abstract: Aspects are disclosed for a piezoelectric device and a method of manufacturing a piezoelectric device. For example, the piezoelectric device can include a substrate, a piezoelectric layer, and an electrode formed on the substrate. The electrode includes a conductive layer and a conductive protective layer that is different from the conductive layer. The piezoelectric device can further include an interconnect formed on the piezoelectric layer over the conductive protective layer of the electrode. The interconnect provides an electrical path from the electrode to the piezoelectric layer.

Abstract: An integrated device comprising a die substrate; a die interconnection portion coupled to the die substrate; and a metallization interconnect coupled to the die interconnection portion. The metallization interconnect comprises an adhesion metal layer, a first metal layer coupled to the adhesion metal layer; a second metal layer coupled to the first metal layer, and a third metal layer coupled to the second metal layer.

Abstract: The present invention provides a textured polymer substrate comprising nano-sized surface features that are arranged in a single array or in a hierarchical array, and at least one layer of an amorphous, hydrophilic layer deposited thereon. The disclosed textured polymer substrate is advantageously suited for providing anti-reflective, anti-fogging and anti-UV materials.