Patents by Inventor René Bouman

René Bouman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATION AND CALIBRATION USING SUCH SYSTEMS
    Publication number: 20230148420
    Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.
    Type: Application
    Filed: January 3, 2023
    Publication date: May 11, 2023
    Inventors: Alain De Bock, René Bouman
  • Die attach systems including a verification substrate
    Patent number: 11574832
    Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: February 7, 2023
    Assignee: Assembléon B.V.
    Inventors: Alain De Bock, René Bouman
  • DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATION AND CALIBRATION USING SUCH SYSTEMS
    Publication number: 20200075381
    Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 5, 2020
    Inventors: Alain De Bock, René Bouman