Abstract: The present invention concerns a new antimicrobial denture adhesive composition useful to be used for fixing dentures, which includes copper nanoparticles (CuNPs) that provides antimicrobial properties against dental pathogens such as Candida albicans, Streptococcus mutans, Staphylococcus aureus and Aggregatibacter actinomycetemcomitans. Surprisingly, the composition for a denture adhesive comprising copper nanoparticles (CuNPs) not only shown excellent antimicrobial properties, but also improved adhesive properties in comparison with other denture adhesives existing currently in the marked, which do not contain said CuNPs.