Patents by Inventor Ren-Guei LIN

Ren-Guei LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING HEAD, CHEMICAL-MECHANICAL POLISHING SYSTEM AND METHOD FOR POLISHING SUBSTRATE
    Publication number: 20220355437
    Abstract: A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Bin HSU, Ren-Guei LIN, Feng-Inn WU, Sheng-Chen WANG, Jung-Yu LI
  • Polishing head, chemical-mechanical polishing system and method for polishing substrate
    Patent number: 11407083
    Abstract: A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: August 9, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Bin Hsu, Ren-Guei Lin, Feng-Inn Wu, Sheng-Chen Wang, Jung-Yu Li
  • POLISHING HEAD, CHEMICAL-MECHANICAL POLISHING SYSTEM AND METHOD FOR POLISHING SUBSTRATE
    Publication number: 20190308295
    Abstract: A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.
    Type: Application
    Filed: June 24, 2019
    Publication date: October 10, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Bin HSU, Ren-Guei LIN, Feng-Inn WU, Sheng-Chen WANG, Jung-Yu LI
  • Polishing head, chemical-mechanical polishing system and method for polishing substrate
    Patent number: 10328549
    Abstract: A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: June 25, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Bin Hsu, Ren-Guei Lin, Feng-Inn Wu, Sheng-Chen Wang, Jung-Yu Li
  • POLISHING HEAD, CHEMICAL-MECHANICAL POLISHING SYSTEM AND METHOD FOR POLISHING SUBSTRATE
    Publication number: 20150158140
    Abstract: A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Bin HSU, Ren-Guei LIN, Feng-Inn WU, Sheng-Chen WANG, Jung-Yu LI