Abstract: A mask substrate, photomask and method for forming the same are provided. The photomask includes a substantially light transparent substrate and a circuitry pattern disposed over the light transparent substrate. The circuitry pattern includes a phase shifting layer disposed over the substantially light transparent substrate. A substantially light shielding layer is disposed over the phase shifting layer. At least one barrier layer is disposed over the substantially light shielding layer. An uppermost portion of the substantially light shielding layer does not comprise anti-reflective properties and the at least one barrier layer comprises an uppermost hardmask layer and an underlying anti-reflective layer.

Abstract: A mask substrate, photomask and method for forming the same are provided. The photomask includes a substantially light transparent substrate and a circuitry pattern disposed over the light transparent substrate. The circuitry pattern includes a phase shifting layer disposed over the substantially light transparent substrate. A substantially light shielding layer is disposed over the phase shifting layer. At least one barrier layer is disposed over the substantially light shielding layer. An uppermost portion of the substantially light shielding layer does not comprise anti-reflective properties and the at least one barrier layer comprises an uppermost hardmask layer and an underlying anti-reflective layer.

Abstract: A mask and method for forming the same including carrying out a photolithographic patterning process the method including providing a substantially light transparent portion; forming a substantially light shielding layer disposed over the substantially light transparent portion; forming at least one barrier layer disposed over the substantially light shielding layer; forming a resist layer disposed over the at least one barrier layer; patterning the resist layer for producing a circuitry pattern; and, carrying out an etching process according to the circuitry pattern to expose a portion of the substantially light transparent portion to form a mask.

Abstract: A mask and method for forming the same including carrying out a photolithographic patterning process the method including providing a substantially light transparent portion; forming a substantially light shielding layer disposed over the substantially light transparent portion; forming at least one barrier layer disposed over the substantially light shielding layer; forming a resist layer disposed over the at least one barrier layer; patterning the resist layer for producing a circuitry pattern; and, carrying out an etching process according to the circuitry pattern to expose a portion of the substantially light transparent portion to form a mask.

Abstract: Within a charged particle beam exposure method for forming a patterned resist layer there is employed separating at least one adjacent pair of fractured pattern elements employed in forming a contiguous latent pattern within a blanket resist layer a gap. By employing the gap, a patterned resist layer formed incident to development of the blanket resist layer is formed with enhanced pattern fidelity and enhanced critical dimension control.

Abstract: Secondary mask pattern elements are used to interconnect isolated sub-patterns of a mask pattern. The interconnection of the isolated sub-patterns prevents different electrostatic charge accumulation on the various isolated sub-patterns. This prevents mask damage due to electrostatic discharge, problems with mask inspection, and problems with mask repair due to different electrostatic charge accumulation on various isolated sub-patterns. The mask is used to transfer the mask pattern to a layer of photosensitive material. The width of the secondary sub-pattern elements are sufficiently small relative to the wavelength of the light used to transfer the mask pattern to the photosensitive material that the secondary sub-pattern elements are not transferred to the photosensitive material.

Abstract: This invention describes methods of using pattern fracture rules to form mask pattern segments and the mask for the mask pattern segments. The mask pattern segments have optical proximity correction and are separated into regular pattern elements and optical proximity correction elements. Regular fracture elements and special fracture elements are used. The special fracture elements are parallel to the regular fracture elements, perpendicular to the regular fracture elements, or both parallel to and perpendicular to the regular fracture elements. The special fracture elements are used to define the regular pattern elements and prevent the formation of resist residue in the completed mask. The optical proximity correction elements are formed using the regular fracture elements.

Abstract: A method of adding optical proximity correction, OPC, to a base pattern is described. A base pattern is represented by a digital base pattern data file. A first OPC data file representing a first OPC pattern which adds pattern width at exterior corners of the pattern and a second OPC data file representing a second OPC pattern which reduces pattern width at interior corners of the pattern are formed. The final data file results from the logical subtraction of the second OPC data file from an interim data file formed by the logical OR of the base pattern data file and the first OPC data file. The final data file can be used to form masks or to inspect masks.

Abstract: Within a charged particle beam exposure method for forming a patterned resist layer there is employed separating at least one adjacent pair of fractured pattern elements employed in forming a contiguous latent pattern within a blanket resist layer a gap. By employing the gap, a patterned resist layer formed incident to development of the blanket resist layer is formed with enhanced pattern fidelity and enhanced critical dimension control.

Abstract: A methodolgy is described which allows a variety of optical proximity corrections to be added to a mask pattern at low cost and with a view to minimizing the number of electron beam exposures that will be needed later when the reticle is prepared. The basic approach is to add serifs and/or hammerheads to the vertices of the mask pattern on the basis of a small number of simple rule checks. The first check is for the presence of an overlapping pattern at the next level. If this is not detected noting is added at the vertex in question. If some overlap is etected, a predefined search area (at the same mask level) is quickly scanned and, if another stripe is found to be located within a preset distance, serifs are added at the appropriate vertices. If no stripe was found, a second search area, further away, is scanned and if a neighbouring stripe is detected this time, larger serifs are added. If the second search also comes up empty, a hammerhead is added at the appropriate line end.