Patents by Inventor Ren-Haur Hwang

Ren-Haur Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7102483
    Abstract: An over-current protector comprised of multiple over-current protection devices each at various switching temperature and provided with positive temperature coefficient; all devices being stacked and segregated with an reinforced insulation layer and connected in parallel through a conducting mechanism each respectively provided at where in relation to both ends of the device; both conducting mechanisms constituting the terminal electrodes of the over-current protector as a whole for reducing initial resistance, increasing peak resistance, and in turn upgrading voltage withstanding performance.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: September 5, 2006
    Assignee: Protectronics Technology Corporation
    Inventors: Ren-Haur Hwang, Chien-Shan Huang, Rei-Yian Chen, Jui-Kuang Chang
  • Patent number: 7069641
    Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: July 4, 2006
    Assignee: Protectronics Technology Corporation
    Inventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
  • Publication number: 20050200445
    Abstract: An over-current protector comprised of multiple over-current protection devices each at various switching temperature and provided with positive temperature coefficient; all devices being stacked and segregated with an reinforced insulation layer and connected in parallel through a conducting mechanism each respectively provided at where in relation to both ends of the device; both conducting mechanisms constituting the terminal electrodes of the over-current protector as a whole for reducing initial resistance, increasing peak resistance, and in turn upgrading voltage withstanding performance.
    Type: Application
    Filed: December 13, 2004
    Publication date: September 15, 2005
    Inventors: Ren-Haur Hwang, Chien-Shan Huang, Rei-Yian Chen, Jui-Kuang Chang
  • Patent number: 6873244
    Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: March 29, 2005
    Assignee: Protectronics Technology Corporation
    Inventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
  • Publication number: 20030227368
    Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
    Type: Application
    Filed: May 19, 2003
    Publication date: December 11, 2003
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
  • Publication number: 20030217457
    Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 27, 2003
    Applicant: Protectronics Technology Corporation
    Inventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
  • Patent number: 6590491
    Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: July 8, 2003
    Assignee: Protectronics Technology Corporation
    Inventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
  • Publication number: 20020130757
    Abstract: The present invention discloses a surface mountable polymeric circuit protection device. The surface mountable polymeric circuit protection device is formed by configuring a conductive polymeric element having PTC features in combination with a top electrode, a bottom electrode and an insulative layer therebetween without conductive mechanisms between the top and the bottom electrodes.
    Type: Application
    Filed: October 31, 2001
    Publication date: September 19, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chien-Shan Huang, Ren-Haur Hwang, Chen-Ron Lin
  • Publication number: 20020125983
    Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.
    Type: Application
    Filed: January 24, 2002
    Publication date: September 12, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
  • Publication number: 20020058208
    Abstract: The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device.
    Type: Application
    Filed: October 1, 2001
    Publication date: May 16, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chen-Ron Lin, Rei-Yian Chen, Ren-Haur Hwang, Chih-Yi Chang