Patents by Inventor Ren Haw Chen

Ren Haw Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100239701
    Abstract: The present invention, in accordance with the shrinking behavior of heat-melt material during cooling and demolding of molding process, presents a molding structure with electrical heating lines embedded on the surface of the molding structure which allows the structure to provide independent thermal control. By allowing the mold to control its surface temperature, the thermal stress between the heat-melt material and the mold can be eliminated and balanced, thereby preventing the heat-melt material from damage by the gripping force during demolding process.
    Type: Application
    Filed: March 20, 2009
    Publication date: September 23, 2010
    Inventors: Ren Haw Chen, An Cheng Liou