Patents by Inventor Ren-Hun Jin

Ren-Hun Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE
    Publication number: 20110180764
    Abstract: The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the presence of a compound obtained by bonding polyethylene glycol to polyethyleneimine having a certain molecular weight and then by performing a concentration step and a drying step. A plastic substrate is obtained by directly applying a conductive paste that uses the powder on a plastic substrate and by performing drying.
    Type: Application
    Filed: June 10, 2009
    Publication date: July 28, 2011
    Applicant: DIC Corporation
    Inventors: Akeo Takahashi, Kaori Kawamura, Seung Taeg Lee, Ren-Hun Jin, Koichiro Matsuki, Tomoyo Kajii