Patents by Inventor Ren Jay Lin

Ren Jay Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of polymer-matrix conductive film and method for fabricating the same
    Patent number: 7598609
    Abstract: A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: October 6, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Ruoh Huey Uang, Yu Chih Chen, Ren Jay Lin, Syh Yuh Cheng
  • Structure of polymer-matrix conductive film and method for fabricating the same
    Publication number: 20060081989
    Abstract: A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
    Type: Application
    Filed: November 30, 2004
    Publication date: April 20, 2006
    Applicant: Industrial Technology Research Institute
    Inventors: Ruoh-Huey Uang, Yu-Chih Chen, Ren-Jay Lin, Syh-Yuh Cheng