Patents by Inventor Ren-Jie Lee

Ren-Jie Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pin-out designation method for package-board codesign
    Patent number: 8302067
    Abstract: A pin out designation method for package board codesign has steps of defining pin characteristics and requirements, generating multiple pin patterns, pin blocks construction and grouping and pin blocks floorplanning. Designers may use an EDA tool to generate multiple pin patterns and may use the pin patterns to construct multiple pin blocks, to group the pin blocks around four sides of a chip and to adjust the pin blocks into a minimized package size of the chip.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: October 30, 2012
    Assignee: National Chiao Tung University
    Inventors: Ren-Jie Lee, Hung-Ming Chen
  • Pin-out Designation Method for Package-Board Codesign
    Publication number: 20110093828
    Abstract: A pin out designation method for package board codesign having steps of defining pin characteristics and requirements, generating multiple pin patterns, pin blocks construction and grouping and pin blocks floorplanning. Designers may use an EDA tool to generate multiple pin patterns, use the pin patterns to construct multiple pin blocks, group the pin blocks around four sides of a chip and adjusts the pin blocks into a minimized package size of the chip.
    Type: Application
    Filed: October 19, 2009
    Publication date: April 21, 2011
    Inventors: Ren-Jie Lee, Hung-Ming Chen