Patents by Inventor Ren KANG

Ren KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153806
    Abstract: An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a wafer carrier.
    Type: Application
    Filed: January 15, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ren-Hau Wu, Cheng-Lung Wu, Jiun-Rong Pai, Cheng-Kang Hu
  • Patent number: 11915958
    Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The operation method includes bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, where the engaging mechanism is disposed on the base frame; transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ren-Hau Wu, Cheng-Lung Wu, Jiun-Rong Pai, Cheng-Kang Hu
  • Publication number: 20210210478
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 8, 2021
    Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH
  • Publication number: 20180231258
    Abstract: A system for heating water in a hot water storage tank, comprising a heater; and means for drawing water onto the heater to be heated from beneath the heater.
    Type: Application
    Filed: August 5, 2016
    Publication date: August 16, 2018
    Inventors: Peter ARMSTRONG, Ren KANG, Malcolm MCCULLOCH
  • Publication number: 20180017270
    Abstract: A diffuser plate for diffusing a fluid flow in a fluid storage vessel, comprising: a plate having a plurality of holes for the fluid flow to pass through; and at least one wall that extends away from a surface of the plate.
    Type: Application
    Filed: November 2, 2015
    Publication date: January 18, 2018
    Inventors: Peter ARMSTRONG, Ren KANG, Malcolm MCCULLOCH
  • Patent number: 9252727
    Abstract: A peripheral apparatus, for connecting to a first or a second transmission port of an electronic device, includes a signal transmission interface, a triggering unit, an amplifying unit and an adjusting unit. The signal transmission interface, coupled to the first or the second transmission port, includes a first and a second group of pins. The triggering unit is coupled to the signal transmission interface. When the signal transmission interface is coupled to the first or the second transmission port, the triggering unit outputs a first or a second voltage level signal, respectively. The amplifying unit is coupled to the signal transmission interface and a functional unit. The adjusting unit, coupled to the signal transmission interface, the triggering unit, the amplifying unit and the functional unit, changes an output power transmitted from the amplifying unit to the functional unit according to the first or the second voltage level signal.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: February 2, 2016
    Assignee: KYE SYSTEMS CORP.
    Inventors: Jen-Fu Huang, Chih-Chien Liao, Nine-Ren Kang
  • Patent number: 7442166
    Abstract: A disposable two-step endoscope for examining human organs includes an image capturing and transmission device and a cable that may be disconnected. The image capturing and transmission device includes a body, luminous devices, an optical image capturing device, a wireless transmission device and an internal power supply. The cable transmits the electric power outside and signals. The luminous device projects light on the human organs. The optical image capturing device captures organ images. The wireless transmission device transmits the organ images outside the human body. The internal power supply provides electric power for signal transmission after the cable and the image capturing and transmission device are separated.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: October 28, 2008
    Assignee: Chung Shan Institute of Science and Technology
    Inventors: Ker-Jer Huang, Der-Ren Kang, Ping-Kuo Weng, Wei-Wu Kuo, Hsien-Ming Wu
  • Patent number: 7438562
    Abstract: A metal-wrapped flash-memory-drive device has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a circuit board that is encapsulated by a plastic case. Components are mounted onto the circuit board. A metal wrap conforms to the general shape of a plastic sub-assembly of the plastic case and a plastic cover that enclose the circuit board. The metal wrap can be bent around the plastic sub-assembly in a forming process, or can be pre-formed into a metal tube that the plastic sub-assembly is inserted into. Alignment holes in the metal wrap can fit over plastic stubs on the plastic sub-assembly, or friction can hold the metal wrap to the plastic sub-assembly. The plastic cover and case can be bonded together by molding, ultrasonically, with adhesive films, or using snaps to form the plastic sub-assembly.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: October 21, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Ren-Kang Chiou
  • Patent number: 7427217
    Abstract: Extended Universal-Serial-Bus (USB) plugs and sockets are disclosed. The extended USB plug includes an extended pin substrate having an extended substrate length longer than a length of a pin substrate of an industry-standard USB connector plug. There is further included a plurality of USB connector contacts configured to carry USB signals and a plurality of non-USB connector contacts configured to carry non-USB signals. The extended Universal-Serial-Bus (USB) plug, which includes an extended pin substrate having an extended substrate length longer than a length of a pin substrate of an industry-standard USB connector plug. There is included a plurality of USB connector contacts configured to carry USB signals and a plurality of non-USB connector contacts configured to carry non-USB signals.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: September 23, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Horng-Yee Chou, Ren-Kang Chiou, Szu-Kuang Chou
  • Publication number: 20080038877
    Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.
    Type: Application
    Filed: October 15, 2007
    Publication date: February 14, 2008
    Applicant: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou, I-Kang Yu
  • Publication number: 20080014771
    Abstract: A metal-wrapped flash-memory-drive device has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a circuit board that is encapsulated by a plastic case. Components are mounted onto the circuit board. A metal wrap conforms to the general shape of a plastic sub-assembly of the plastic case and a plastic cover that enclose the circuit board. The metal wrap can be bent around the plastic sub-assembly in a forming process, or can be pre-formed into a metal tube that the plastic sub-assembly is inserted into. Alignment holes in the metal wrap can fit over plastic stubs on the plastic sub-assembly, or friction can hold the metal wrap to the plastic sub-assembly. The plastic cover and case can be bonded together by molding, ultrasonically, with adhesive films, or using snaps to form the plastic sub-assembly.
    Type: Application
    Filed: July 19, 2007
    Publication date: January 17, 2008
    Applicant: Super Talent Electronics, Inc.
    Inventors: Jim Ni, Ren-Kang Chiou
  • Patent number: 7301776
    Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: November 27, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou, I-Kang Yu
  • Patent number: 7296345
    Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: November 20, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou, Edward W. Lee
  • Patent number: 7297024
    Abstract: A metal-wrapped flash-memory-drive device has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a circuit board that is encapsulated by a plastic case. Components are mounted onto the circuit board. A metal wrap conforms to the general shape of a plastic sub-assembly of the plastic case and a plastic cover that enclose the circuit board. The metal wrap can be bent around the plastic sub-assembly in a forming process, or can be pre-formed into a metal tube that the plastic sub-assembly is inserted into. Alignment holes in the metal wrap can fit over plastic stubs on the plastic sub-assembly, or friction can hold the metal wrap to the plastic sub-assembly. The plastic cover and case can be bonded together by molding, ultrasonically, with adhesive films, or using snaps to form the plastic sub-assembly.
    Type: Grant
    Filed: April 12, 2005
    Date of Patent: November 20, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Ren-Kang Chiou
  • Patent number: 7269004
    Abstract: A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all of the ICs are formed on a side of a PCB opposite to the metal contacts. The ICs include, for example, a USB controller chip and flash memory chip or communication chip. A housing is attached over the ICs and extends a minimum height above the metal contacts.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: September 11, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Ni, Ren-Kang Chiou
  • Patent number: 7235423
    Abstract: Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: June 26, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Paul Hsueh, Ren-Kang Chiou
  • Patent number: 7215551
    Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: May 8, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou
  • Patent number: 7186147
    Abstract: A peripheral device having a device processor, a multi-personality bus switch, and an extended Universal-Serial Bus (USB) plug is disclosed. The peripheral device is capable of communicating with a host computer using one or more protocols. The extended Universal-Serial Bus (USB) plug includes an extended pin substrate, the extended pin substrate and at least some of a plurality of contacts thereon being dimensioned to be mechanically compatible with an industry-standard USB socket. The extended USB plug further lacks an industry-standard cover associated with an industry-standard USB plug, thereby causing the extended USB plug to be thinner than the industry-standard USB plug.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: March 6, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Horng-Yee Chou, Ren-Kang Chiou, Edward W. Lee
  • Patent number: RE40115
    Abstract: A slim male Universal-Serial-Bus (USB) connector fits on only one side of the connector substrate in a standard female USB connector. Wobble or vertical play is reduced by locking depressions in the slim male USB connector that engage metal springs on a metal case that surrounds the female USB connector, locking the two connectors together. Between metal contacts on the slim USM connector are dividers that help fill in gaps when the two connectors are connected together, further reducing play. End rails on the slim USB connector fill in gaps on the sides. The connector substrate of the slim male USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip. The connector is wider than the standard width for a better fit. A slim female USB connector for assembly use with the slim male USB connector is also disclosed.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: February 26, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Edward W. Lee, Ren-Kang Chiou, Tzu-Yih Chu
  • Patent number: D678677
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: March 26, 2013
    Inventor: Zhong Ren'kang