Patents by Inventor Ren-Long Kuo
Ren-Long Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8928104Abstract: An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.Type: GrantFiled: November 17, 2010Date of Patent: January 6, 2015Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Patent number: 8847146Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.Type: GrantFiled: October 15, 2009Date of Patent: September 30, 2014Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Patent number: 8828777Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.Type: GrantFiled: January 25, 2011Date of Patent: September 9, 2014Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
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Patent number: 8481343Abstract: A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate; providing a sensor chip disposed on the substrate; providing a lens module set over the sensing area of the chip to form a semi-finished component; providing a mold that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween; injecting a molding compound into the mold cavity; and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound. The buffer layer can fill the air gap between the upper surface of the lens module and the upper mold member, thereby preventing the upper surface of the lens module from being polluted by the molding compound.Type: GrantFiled: December 7, 2010Date of Patent: July 9, 2013Assignee: Kingpak Technology Inc.Inventors: Chung-Hsien Hsin, Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Patent number: 8441086Abstract: An image sensor packaging structure with a predetermined focal length is provided. The image sensor packaging structure includes a substrate, a chip, an optical assembly, and an encapsulation compound. The chip has a sensitization area and is coupled to the substrate. Conductive contacts on the substrate are electrically connected with conductive contacts around the sensitization area. The optical assembly has the predetermined focal length and is disposed above the chip so as to form an air cavity between the optical assembly and the sensitization area of the chip. The encapsulation compound is formed on the substrate to surround the chip and the optical assembly. With the above stated structure, not only can the focus adjusting procedure be dispensed with, but also the image sensor packaging structure can be manufactured by a molding or dispensing process.Type: GrantFiled: November 16, 2010Date of Patent: May 14, 2013Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Patent number: 8390087Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.Type: GrantFiled: January 7, 2010Date of Patent: March 5, 2013Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Patent number: 8378441Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.Type: GrantFiled: January 21, 2011Date of Patent: February 19, 2013Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
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Publication number: 20120068288Abstract: A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate; providing a sensor chip disposed on the substrate; providing a lens module set over the sensing area of the chip to form a semi-finished component; providing a mold that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween; injecting a molding compound into the mold cavity; and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound. The buffer layer can fill the air gap between the upper surface of the lens module and the upper mold member, thereby preventing the upper surface of the lens module from being polluted by the molding compound.Type: ApplicationFiled: December 7, 2010Publication date: March 22, 2012Applicant: Kingpak Technology Inc.Inventors: Chung-Hsien Hsin, Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Patent number: 8093674Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.Type: GrantFiled: October 22, 2009Date of Patent: January 10, 2012Assignee: Kingpak Technology, Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Publication number: 20110241146Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.Type: ApplicationFiled: January 21, 2011Publication date: October 6, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
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Publication number: 20110241147Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.Type: ApplicationFiled: January 25, 2011Publication date: October 6, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
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Publication number: 20110156188Abstract: An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.Type: ApplicationFiled: November 17, 2010Publication date: June 30, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Publication number: 20110156187Abstract: An image sensor packaging structure with a predetermined focal length is provided. The image sensor packaging structure includes a substrate, a chip, an optical assembly, and an encapsulation compound. The chip has a sensitization area and is coupled to the substrate. Conductive contacts on the substrate are electrically connected with conductive contacts around the sensitization area. The optical assembly has the predetermined focal length and is disposed above the chip so as to form an air cavity between the optical assembly and the sensitization area of the chip. The encapsulation compound is formed on the substrate to surround the chip and the optical assembly. With the above stated structure, not only can the focus adjusting procedure be dispensed with, but also the image sensor packaging structure can be manufactured by a molding or dispensing process.Type: ApplicationFiled: November 16, 2010Publication date: June 30, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao
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Publication number: 20110024862Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.Type: ApplicationFiled: January 7, 2010Publication date: February 3, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Publication number: 20110024610Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.Type: ApplicationFiled: October 15, 2009Publication date: February 3, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Publication number: 20110024861Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.Type: ApplicationFiled: October 22, 2009Publication date: February 3, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin