Abstract: A process and structure for mounting a small sample in an opening in a larger substrate by using an intermediate size structure, wherein the small sample is mounted in a small opening in the intermediate size structure which then, in turn, is mounted in an intermediate size opening in the large substrate. As a result, the formation of gaps around the edge of the sample may be voided. The process is carried out by first mounting the test sample in a opening formed with tapered sidewalls through a die with the upper surface of the sample directly abutting the edges of the smallest portion of the tapered opening in the die, The die is then mounted in an opening with tapered sidewalls in a test wafer. The opening in the die is sized to equal, at the smallest end of the tapered sidewalls of the opening, the width and length of the square sample.