Abstract: Electronic modules are transported with respect to equipment for manipulating and testing electronic modules. The transport is formed from a thin support having openings for receiving electronic modules. A locating mechanism associated with the thin support serves to locate the support relative to transport and testing equipment. A mechanism is further provided for holding the received electronic modules within the openings during transport and testing.

Abstract: A machine for testing electronic components or chips formed in a wafer (3) and each comprising a multiplicity of electrical connection pads formed on the surface of the wafer, which machine includes a test head (5) having a multiplicity of electrical connection test prods (11) and a mechanism for moving the wafer to be tested with respect to the head so as to bring the ends of the test prods into contact with the pads of each chip, in succession. The test head (5) carries heating and temperature-regulating elements (18) thermally coupled to the electrical connection test prods (11). Preferably, the test head (5) includes a metal block (16) thermally coupled to the electrical connection test prods (11). The heating and temperature-regulating elements (18) are thermally coupled to the metal block.