Abstract: Electronic modules are transported with respect to equipment for manipulating and testing electronic modules. The transport is formed from a thin support having openings for receiving electronic modules. A locating mechanism associated with the thin support serves to locate the support relative to transport and testing equipment. A mechanism is further provided for holding the received electronic modules within the openings during transport and testing.

Abstract: Electronic modules are transported with respect to equipment for manipulating and testing electronic modules. The transport is formed from a thin support having openings for receiving electronic modules. A locating mechanism associated with the thin support serves to locate the support relative to transport and testing equipment. A mechanism is further provided for holding the received electronic modules within the openings during transport and testing.

Abstract: An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.

Abstract: An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.

Abstract: A machine for testing electronic components or chips formed in a wafer (3) and each comprising a multiplicity of electrical connection pads formed on the surface of the wafer, which machine includes a test head (5) having a multiplicity of electrical connection test prods (11) and a mechanism for moving the wafer to be tested with respect to the head so as to bring the ends of the test prods into contact with the pads of each chip, in succession. The test head (5) carries heating and temperature-regulating elements (18) thermally coupled to the electrical connection test prods (11). Preferably, the test head (5) includes a metal block (16) thermally coupled to the electrical connection test prods (11). The heating and temperature-regulating elements (18) are thermally coupled to the metal block.

Abstract: A ring maintains a circular daughtercard (32) plugged into a mothercard (30) and includes structure for removing the daughtercard from the mothercard. The ring includes: an inner vertical threading to be screwed on an external threading fixed to the mothercard (30), and a bottom portion having a cylindric recess for accommodating the daughtercard (32), the recess being coaxial to the threadings and having a depth substantially equal to the thickness of the daughtercard (32). The ring also includes at its bottom portion a plurality of vertical traversing rods (42) distributed about the recess, each having, at one end, an eccentric portion for releasing the daughtercard (44), and, at the other end, a roller for manipulating the rod and the eccentric portion.