Abstract: A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has multiple insertion holes. The pins of the electronic component are inserted into corresponding insertion holes of the circuit board. The thermally-conductive adhesive interface has a first surface bonded with the heat-dissipating element and a second surface bonded with the electronic component. As a consequence, the electronic component is fixed on the heat-dissipating element through the thermally-conductive adhesive interface, and the heat generated by the electronic component is transmitted to the heat-dissipating element through the thermally-conductive adhesive interface.