Patents by Inventor Ren-Wen Wang

Ren-Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE
    Publication number: 20120182686
    Abstract: An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element.
    Type: Application
    Filed: April 7, 2011
    Publication date: July 19, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XUE-DONG TANG, KE-HUI PENG, REN-WEN WANG, PING LI
  • Front bezel for a computer enclosure
    Patent number: D614629
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: April 27, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ren-Wen Wang
  • Front bezel for a computer enclosure
    Patent number: D614630
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: April 27, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ren-Wen Wang
  • Front bezel for a computer enclosure
    Patent number: D619585
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: July 13, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ren-Wen Wang