Patents by Inventor Ren Yih Jeng

Ren Yih Jeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reinforced assembly carrier
    Patent number: 8273445
    Abstract: A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: September 25, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ren Yih Jeng, Kuang Hsiung Chen, Chun Hung Hsu
  • REINFORCED ASSEMBLY CARRIER AND METHOD FOR MANUFACTURING THE SAME AS WELL AS METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGES
    Publication number: 20090252931
    Abstract: A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.
    Type: Application
    Filed: June 9, 2008
    Publication date: October 8, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
    Inventors: Ren Yih JENG, Kuang Hsiung CHEN, Chun Hung HSU