Patents by Inventor Rena Kojima

Rena Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting sheet, dicing die bonding film, and semiconductor apparatus
    Patent number: 11791302
    Abstract: Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 ?m or more and 1.2 ?m or less that is measured in a state before being cured.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: October 17, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Rena Kojima, Tomoaki Ichikawa
  • THERMOSETTING SHEET AND DICING DIE BONDING FILM
    Publication number: 20220325091
    Abstract: A thermosetting sheet according to the present invention includes a thermosetting resin and a thermoplastic resin, in which a thickness change rate when a temperature is changed from 25° C. to 200° C. is 0% or more and 10% or less.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 13, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rena Kojima, Tomoaki Ichikawa
  • THERMOSETTING SHEET, DICING DIE BONDING FILM, AND SEMICONDUCTOR APPARATUS
    Publication number: 20220130790
    Abstract: Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 ?m or more and 1.2 ?m or less that is measured in a state before being cured.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 28, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rena Kojima, Tomoaki Ichikawa
  • THERMOSETTING SHEET AND DICING DIE BONDING FILM
    Publication number: 20210403784
    Abstract: A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D50 of 0.01 ?m or more and 10 ?m or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa·s or more and 3000 kPa·s or less.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 30, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rena Kojima, Tomoaki Ichikawa