Abstract: A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.

Abstract: An image generating device comprises a light source producing a light beam and a screen (5) traversed by the light beam and designed to modify the light beam so as to form an image. The screen (5) comprises a transparent element (150) traversed by the light beam and designed to evacuate the heat generated at the level of the screen (5). Said transparent element (150) is made of sintered transparent ceramic. Also described are a head-up display comprising such a device, and a method for manufacturing an image generating device.

Abstract: An image generating device comprises a light source producing a light beam and a screen (5) traversed by the light beam and designed to modify the light beam so as to form an image. The screen (5) comprises a transparent element (150) traversed by the light beam and designed to evacuate the heat generated at the level of the screen (5). Said transparent element (150) is made of sintered transparent ceramic. Also described are a head-up display comprising such a device, and a method for manufacturing an image generating device.

Abstract: The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.

Abstract: The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.