Patents by Inventor Renata Melamud Berger
Renata Melamud Berger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240056054Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.Type: ApplicationFiled: August 14, 2023Publication date: February 15, 2024Inventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Patridge, Markus Lutz
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Publication number: 20230397818Abstract: A wearable device. In some embodiments, the wearable device includes: a sensing module; and a strap attached to the sensing module, the wearable device being configured to be worn by a user, with a lower surface of the sensing module in contact with the user, the strap extending over an upper surface of the sensing module.Type: ApplicationFiled: August 16, 2023Publication date: December 14, 2023Inventors: Todd Andrew NEWHOUSE, Evan Einbender AAMODT, Hooman ABEDIASL, Adrian Williamson BAHANI, Kate LeeAnn BECHTEL, Renata Melamud BERGER, Patrick John CASTAGNA, Suresh CHENGALVA, Lok Man CHU, Jennifer Lynn CORSO, Cristiano DALVI, Jeffrey DRISCOLL, Alexander FAST, Craig GADD, Alexander GONDARENKO, Richard GROTE, Christopher Alan HARRIS, Vafa JAMALI, Haydn Frederick JONES, Vish KULKARNI, Ferdyan LESMANA, Sean MERRITT, Roozbeh PARSA, Philip PEREA, Kyle RICK, Andrew George RICKMAN, Adam SCOFIELD, Breanna STACHOWSKI, Benjamin VER STEEG, Guomin YU, Aaron John ZILKIE
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Patent number: 11770112Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.Type: GrantFiled: March 10, 2021Date of Patent: September 26, 2023Assignee: SiTime CorporationInventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Partridge, Markus Lutz
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Patent number: 11517938Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.Type: GrantFiled: August 21, 2018Date of Patent: December 6, 2022Assignee: InvenSense, Inc.Inventors: Mei-Lin Chan, Nikhil Apte, Renata Melamud Berger
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Patent number: 11471912Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.Type: GrantFiled: October 3, 2019Date of Patent: October 18, 2022Assignee: InvenSense, Inc.Inventors: Nikhil Apte, Renata Melamud Berger, Michael Daneman
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Patent number: 11107858Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.Type: GrantFiled: October 28, 2019Date of Patent: August 31, 2021Assignee: InvenSense, Inc.Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
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Publication number: 20200355824Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.Type: ApplicationFiled: June 1, 2020Publication date: November 12, 2020Applicant: InvenSense, Inc.Inventors: Nikhil APTE, Julius Ming-Lin TSAI, Michael Julian DANEMAN, Renata Melamud BERGER
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Publication number: 20200194495Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.Type: ApplicationFiled: October 28, 2019Publication date: June 18, 2020Applicant: InvenSense, Inc.Inventors: Renata Melamud BERGER, Julius Ming-Lin TSAI, Stephen LLOYD
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Patent number: 10670716Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.Type: GrantFiled: September 15, 2016Date of Patent: June 2, 2020Assignee: InvenSense, Inc.Inventors: Nikhil Apte, Julius Ming-Lin Tsai, Michael Julian Daneman, Renata Melamud Berger
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Patent number: 10632500Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device includes a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies, the membrane having non-uniform stiffness. The membrane includes a piezoelectric layer, a first electrode and a second electrode coupled to opposing sides of the piezoelectric layer, and a mechanical support layer coupled to one of the first electrode and the second electrode.Type: GrantFiled: March 24, 2017Date of Patent: April 28, 2020Assignee: InvenSense, Inc.Inventors: Renata Melamud Berger, Eldwin Ng
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Publication number: 20200061670Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.Type: ApplicationFiled: August 21, 2018Publication date: February 27, 2020Applicant: InvenSense, Inc.Inventors: Mei-Lin CHAN, Nikhil APTE, Renata Melamud BERGER
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Publication number: 20200030850Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.Type: ApplicationFiled: October 3, 2019Publication date: January 30, 2020Applicant: InvenSense, Inc.Inventors: Nikhil APTE, Renata Melamud BERGER, Michael DANEMAN
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Patent number: 10476477Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.Type: GrantFiled: September 6, 2017Date of Patent: November 12, 2019Assignee: SiTime CorporationInventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Partridge, Markus Lutz
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Patent number: 10461124Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.Type: GrantFiled: August 7, 2017Date of Patent: October 29, 2019Assignee: InvenSense, Inc.Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
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Patent number: 10441975Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.Type: GrantFiled: January 30, 2017Date of Patent: October 15, 2019Assignee: InvenSense, Inc.Inventors: Nikhil Apte, Renata Melamud Berger, Michael Daneman
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Patent number: 10408797Abstract: An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.Type: GrantFiled: February 3, 2017Date of Patent: September 10, 2019Assignee: InvenSense, Inc.Inventors: Nikhil Apte, Renata Melamud Berger, Michael Daneman, James Christian Salvia
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Publication number: 20190043920Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.Type: ApplicationFiled: August 7, 2017Publication date: February 7, 2019Applicant: InvenSense, Inc.Inventors: Renata Melamud BERGER, Julius Ming-Lin TSAI, Stephen LLOYD
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Patent number: 10045126Abstract: A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.Type: GrantFiled: December 8, 2015Date of Patent: August 7, 2018Assignee: INVENSENSE, INC.Inventors: Renata Melamud Berger, Sushil Bharatan, Thomas Chen
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Patent number: 9924288Abstract: Systems and techniques for detecting blockage associated with a microelectromechanical systems (MEMS) microphone of a device are presented. The device includes a MEMS acoustic sensor and a processor. The MEMS acoustic sensor is contained in a cavity within the device. The processor is configured to detect a blockage condition associated with an opening of the cavity that contains the MEMS acoustic sensor.Type: GrantFiled: October 29, 2014Date of Patent: March 20, 2018Assignee: INVENSENSE, INC.Inventors: Baris Cagdaser, Renata Melamud Berger, Omid Oliaei, Aleksey S. Khenkin
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Publication number: 20170326591Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.Type: ApplicationFiled: January 30, 2017Publication date: November 16, 2017Applicant: InvenSense, Inc.Inventors: Nikhil APTE, Renata Melamud BERGER, Michael DANEMAN