Abstract: A two dimensional scanner comprising a first mirror (1) rotatable around a first axis (4), and a second mirror (2) rotatable around a second axis (5), said first and second reflective surfaces being formed on the same substrate (3), with their axis of rotation (4, 5) being non parallel in a common plane, and a reflective surface (6) arranged such that a light beam reflected by said first mirror (1) is subsequently reflected by said surface (6) and finally by said second mirror (2). According to the invention, the first mirror is thus capable of scanning said light beam in a first direction and said second mirror is capable of scanning said light beam in a second direction. The result is a very compact two dimensional scanner, where the two individual mirrors are independent of each other, but still can be provided very close together, eliminating, or at least reducing distortion of the image.

Abstract: Disclosed is a method of marking an object by means of a laser beam. Said method comprising the steps of: applying a donor film on a support, said support at least partly being transparent to the laser beam; placing the support with the donor film in proximity to the surface to be patterned, such that the donor film faces the object to be marked; irradiating the donor film with the laser beam through the support, thereby transcribing a pattern of the donor film to the object; and removing the support with the donor film from the object. The donor film has a thickness of at least 0.5 micron. Also disclosed is a marked object that is obtained by means of the above method, wherein the marking has a thickness of at least 0.5 micron.

Abstract: Method suitable for transferring an electronic component (2??) supported by a carrier (3) to a desired position on a substrate (1). The carrier supporting the component is moved relative to the substrate whilst the component is present on a side of the carrier facing towards the substrate, until the component is positioned opposite the desired position on teh substrate. Then a light beam (4) is directed at the carrier (3), at the location of the component (2??), from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.