Abstract: Various embodiments disclosed relate to analyte sensor configurations. The present disclosure can include planar analyte sensors or coaxial analyte sensors. The planar analyte sensors can include one or more insulating and conductive layers and a substrate layered on each other. The coaxial analyte sensors can include one or more co-extruded wire electrodes with a substrate. The continuous analyte monitoring systems discussed herein can be configured to monitor one or more analytes to provide predictive and real-time health data and benefits.

Abstract: The invention relates to a tank (300) comprising an electrical device (400) attached to a first connector (100), said first connector being adapted for being coupled to a second connector, said first connector comprising a first plastic part (110) and at least one first electrically conductive contact element (121, 122), said at least one first electrically conductive contact element being electrically connected with said electrical device, said second connector comprising a second plastic part and at least one second electrically conductive contact element, said at least one second electrically conductive contact element being configured for being coupled with said at least one first electrically conductive contact element, wherein said first plastic part is adhered along a closed curve extending around the at least one first electrically conductive contact element to a plastic portion inside the tank.

Abstract: An interconnection apparatus including: a rigid substrate having a first side and a second side; at least one first connector arranged on the first side; and at least one second connector arranged on the second side. The apparatus can compensate an alignment error of complementary connectors configured to be mated with the at least one first connector and the at least one second connector.

Abstract: An interconnection apparatus including: a rigid substrate having a first side and a second side; at least one first connector arranged on the first side; and at least one second connector arranged on the second side. The apparatus can compensate an alignment error of complementary connectors configured to be mated with the at least one first connector and the at least one second connector.

Abstract: The present invention is related to a method for making a passivated semiconductor substrate comprising the steps of providing a substrate surface comprising or consisting of mono-crystalline semiconductor material other than silicon and forming a silicon layer on the substrate surface, such that the silicon layer is substantially lattice matched to the mono-crystalline semiconductor material. It is also related to a semiconductor substrate passivated according to the method.