Abstract: A nylon compound is disclosed having good through plane thermal conductivity and improved physical strength. The compound comprises a combination of nylon, graphite, and long glass fibers. The through plane thermal conductivity of the compound ranges from about 1 W/m·K to about 4 W/m·K, as measured by the C-Therm Test described herein. This nylon compound is also electrically conductive, preferably having a surface resistivity ranging from about 1×103 Ohm/sq to about 1×105 Ohm/sq as measured by IEC 60093.

Abstract: A nylon compound is disclosed having good through plane thermal conductivity and improved physical strength. The compound comprises a combination of nylon, graphite, and long glass fibers. The through plane thermal conductivity of the compound ranges from about 1 W/m·K to about 4 W/m·K, as measured by the C-Therm Test described herein. This nylon compound is also electrically conductive, preferably having a surface resistivity ranging from about 1×103 Ohm/sq to about 1×105 Ohm/sq as measured by IEC 60093.

Abstract: A thermally conductive polymer article is disclosed, made from a polymer resin and thermally conductive additives, wherein the article has undergone laser structuring and plasma metallization and, preferably, surface-mount technology (SMT) by non-lead reflow soldering, to provide an integrated circuit. The article can be in the shape of a printed circuit board or a LED lighting component among other possibilities. The thermally conductive additive can be either electrically insulative or electrically conductive, or both types can be used. The thermally conductive polymer compound can be extruded, molded, calendered, thermoformed, or 3D-printed before taking shape as a heat dissipating, laser structured, and plasma metalized polymer article.