Abstract: An apparatus for efficiently cooling the heat of a hot target without enlarging the size of a cooling device or needing either a piping to connect an evaporation portion and a condensation portion or a steam circulation pump. An exoergic-side heat exchanger has a fluid passage for the target fluid, and stores a coolant for cooling the fluid in the fluid passage through heat exchange. An endoergic-side heat exchanger has at least two coolant passages, the one ends of which communicate with the endoergic-side heat exchanger, and the other ends of which communicate with each other through a common coolant passage. A cooling device cools the coolant by exchanging heat with the coolant passing through the exoergic-side heat exchanger. The coolant passage has a diameter or an equivalent diameter within a range of 2 mm to 16 mm, and all the coolant passages have a substantially identical or equivalent diameter.

Abstract: An objective of the present invention is to provide a thermoelectric module which can achieve high heat release and heat absorption efficiencies and which can obviate any thermal stress-caused damages. A thermoelectric module (1) in an embodiment has a predetermined number of thermoelectric semiconductor elements P and N which are arranged in a flat plate configuration. Each of the thermoelectric semiconductor elements P and N has on one face thereof a one-side electrode (2) and has on the other face thereof an other-side electrode (3), thereby allowing all of the thermoelectric semiconductor elements P and N to be connected in series. The one-side electrodes (2, 2 . . . ) have heat release/heat absorption fins (heat transfer fins) (2F, 2F . . . ) and the other-side electrodes (3, 3 . . . ) have heat release/heat absorption fins (heat transfer fins) (3F, 3F . . . ).

Abstract: An objective of the present invention is to provide a thermoelectric module which can achieve high heat release and heat absorption efficiencies and which can obviate any thermal stress-caused damages. A thermoelectric module (1) in an embodiment has a predetermined number of thermoelectric semiconductor elements P and N which are arranged in a flat plate configuration. Each of the thermoelectric semiconductor elements P and N has on one face thereof a one-side electrode (2) and has on the other face thereof an other-side electrode (3), thereby allowing all of the thermoelectric semiconductor elements P and N to be connected in series. The one-side electrodes (2, 2 . . . ) have heat release/heat absorption fins (heat transfer fins) (2F, 2F . . . ) and the other-side electrodes (3, 3 . . . ) have heat release/heat absorption fins (heat transfer fins) (3F, 3F . . . ).

Abstract: In a thermoelectric power generation module (7) serving as a heat exchanger, a large number of protrusions (5a) at least the surface of which is made of a material with low wettability are formed with a height and width of less than 0.01 mm and arranged with a pitch of less than 0.01 mm on the heat transfer surface (5s) of a heat transfer plate 5, thereby to increase in heat exchange efficiency.