Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.