Abstract: A vacuum chamber system for semiconductor processing includes at least two evacuable vacuum chambers for receiving semiconductor elements to be processed, each including a vacuum chamber opening and a vacuum chamber sealing surface, and transfer aspects by which one of the vacuum chambers can be moved relative to another of the vacuum chambers and can be docked with it in a vacuum-tight manner by producing substantially parallel opposite positions of the vacuum chamber sealing surfaces which are subject to possible misalignments. At least one of the vacuum chambers has support aspects which support one vacuum chamber on the other vacuum chamber in the evacuated, docked state.

Abstract: A vacuum chamber system for semiconductor processing includes at least two evacuable vacuum chambers (1a, 1b) which are provided for receiving semiconductor elements (5) to be processed and which in each case comprise a vacuum chamber opening (2a; 2b) and a vacuum chamber sealing surface (3a; 3b), and transfer aspects (4) by which one of the vacuum chambers (1a) can be moved relative to another of the vacuum chambers (1b) and can be docked with it (1b) in a vacuum-tight manner by producing substantially parallel opposite positions of the vacuum chamber sealing surfaces (3a, 3b) which are subject to possible misalignments. At least one of the vacuum chambers (1a; 1b) has support aspects which support one vacuum chamber (1a) on the other vacuum chamber (1b) in the evacuated, docked state.