Patents by Inventor Rene Frank Schrottenholzer

Rene Frank Schrottenholzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6644983
    Abstract: A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: November 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Willi Recktenwald, Gerhard Ruehle, Rene Frank Schrottenholzer
  • Patent number: 6646888
    Abstract: According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: November 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Manfred Cwik, Harald Pross, Rene Frank Schrottenholzer
  • Publication number: 20030063447
    Abstract: According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 3, 2003
    Applicant: International Business Machines Corporation
    Inventors: Manfred Cwik, Harald Pross, Rene Frank Schrottenholzer
  • Publication number: 20020111080
    Abstract: A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.
    Type: Application
    Filed: January 16, 2002
    Publication date: August 15, 2002
    Applicant: International Business Machines Corporation
    Inventors: Willi Recktenwald, Gerhard Ruehle, Rene Frank Schrottenholzer