Patents by Inventor Rene Hemond

Rene Hemond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mechanical packaging of electronics
    Patent number: 8644027
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: February 4, 2014
    Assignee: SynQor, Inc.
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Method for Mechanical Packaging of Electronics
    Publication number: 20100328912
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Application
    Filed: July 16, 2010
    Publication date: December 30, 2010
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Method for mechanical packaging of electronics
    Patent number: 7765687
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: August 3, 2010
    Assignee: SynQor, Inc.
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Mechanical packaging of electronics
    Publication number: 20070089293
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Application
    Filed: August 11, 2006
    Publication date: April 26, 2007
    Inventors: Lennart Pitzele, Abram Dancy, Leif LaWhite, Rene Hemond, Martin Schlecht