Abstract: A heat transfer device includes a sleeve, which forms an interior in which a working medium and one vaporization element having structural elements, or multiple vaporization elements having structural elements, for converting at least part of the working medium from the liquid to the gaseous state are contained, wherein the vaporization element or the vaporization elements has or have a porosity, and is or are connected to the sleeve.

Abstract: The invention relates to an air heat exchanger 1 for cooling a power electronics component 2, comprising: a carrier plate 3 having an accommodating region 4 for accommodating the power electronics component 2; a heat exchanger plate 7 which is coupled to the carrier plate 3, wherein at least one hermetically sealed cavity 10 for accommodating a working medium 13 is formed and delimited by the carrier plate 3 and the heat exchanger plate 7, wherein the cavity 10 comprises an evaporator 11 and a condenser 12, wherein the evaporator 11 is arranged so as to be spaced apart from the condenser 12 in a heat transport direction 14; cooling ribs 15 which are coupled to the heat exchanger plate 7.

Abstract: A heat transfer device includes a sleeve, which forms an interior in which a working medium and one vaporization element having structural elements, or multiple vaporization elements having structural elements, for converting at least part of the working medium from the liquid to the gaseous state are contained, wherein the vaporization element or the vaporization elements has or have a porosity, and is or are connected to the sleeve.